Metrology; Topology; Nanotopography; Flatness; Cryst.Orient.

SIMPL- SEM Image Metrology PLatform, Process control monitoring : Image Quality (IQ), Process control monitoring : IC-Metric, Mask Data Preparation

CMP (Chemical Mechanical Polishing) systems and services.

dimensional, materials, and chemical metrology solutions for advanced process control used in semiconductor manufacturing.

Semiconductor front end metrology equipment: optical metrology series for film thickness & properties, and optical critical dimensions; plus X-ray metrology series for film thicknesses, material properties and compositions, surface contamination.

micro- and nanomechanical property measurement instruments that can be applied in a wide variety of testing environments.

Lithography equipment Process equipment, Testing Equipment, Photolithography Equipment, Sol wafer

Semi-automated wafer measurement system for semi-conducting and semi-insulating materials

advanced optical metrology systems and ultra-precise optical components and assemblies. 3D Optical Profiler Systems, Laser Interferometer Systems, Absolute Position Sensors, Displacement Position Sensors, Optical Components, Optical Assemblies

Systems for nondestructive inspection of bonded wafers and packaged semiconductor

Mueller matrix measurement systems for determining the polarization properties of materials and optical components, applications ranging from birefringence mapping and polarizer testing to LCD cell gap testing and thin-film measurements.

Advanced Process Control and Yield Management Software. Defect Inspection and Metrology Systems. Epi Thickness & Composition. Lithography Systems.

Advanced surface & sample preparation equipment and consumables.

Motion control systems, Press tool and die systems, Machine tools and measurement.

Analysis, Measurement and evaluation services: physical and chemical analysis of semiconductor device, FPD and media; Environment evaluation of the clean room. Semiconductor measurement, inspection and sorting systems: lifetime; wafer edge profiler.

Measuring Systems & Measuring Tasks, Measuring Systems, Wafer Inspection, MEMS Inspection, WAFERinspect AOI, Confocal Microscopy

Analysis/Measurement: Auger, X-ray, Surface Inspection/Flatness, SEM, ESCA, Film Thickness. Assembly/Hybrid Equipment: Base Loaders, Automation & Robotics. FPD Assembly Equipment: Liquid Crystal Injection, Lamination. Test/Measurement

Step Height Profiler for FPD, NanoSpec 6500 series, Wafer thin film stress measurement system FLX-2320-S, Wafer surface analizer Candela CS series (manufactured by KLA-Tencor), Wet process equipment for semiconductor and LCD industry

Metrology & Inspection for Semiconductors

Semiconductor wafer metrology tool to measure shape uniformity, nanotopography and roughness of the entire 300mm silicon wafer in a non-contact, single image snapshot.

Measurement tools for the Semiconductor and PV in process control and laboratory characterization. Contactless metrology tools for 1" up to 450mm silicon, quartz, sappphire wafers and plastic display materials.