Full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness
Measures Thickness, TTV, Bow, Warp, Site and Global Flatness.
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Exclusive MTI capacitance sensors for outstanding accuracy and repeatability
Full 1000 µm thickness measurement range without re-calibration
Measures Thickness, TTV, Bow, Warp and site and Global Flatness
Windows® user interface
ASTM Standard measurements
SEMI S2-0200 health and safety compliant design
SEMI S8-0999 ergonomic compliant design
Measures all materials including Si, GaAs, Ge, InP, SiC ***
*** provided bulk resistivity is less than 20K Ohm/cm
About the Semi-automated Metrology System
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The Proforma 300iSA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII’s exclusive Push-Pull capacitance technology, the Proforma 300iSA delivers full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness. User-defined and ASTM/SEMI compliant scan patterns are used to generate full 3-dimensional (3D) wafer images.
Customized data reports are available for viewing tabular data of each wafer measured with quick, easy export to your spreadsheet program.
Wafer Specifications Diameter: 150 mm, 200 mm, 300 mm
Material: All semiconducting and semi-insulating wafers including Si, GaAs, Ge, SiC, InP
Surfaces: As-Cut, Lapped, Etched, Polished, Patterned
Flat/Notch: All SEMI Standard Flat(s) or Notch
Conductivity: P or N Type