METROLOGY SOLUTIONS
TMAP solutions
TMAP-AP
The TMAP-AP is the complete metrology solution for 3D IC/TSV process control with the best balance between performance, throughput and cost of ownership (CoO).
The TMAP-AP measure multiple layer stacks and differentiate them in the order they are placed. Even under highly warped conditions, the TMAP Series’ state of the art design provides dependable measurement where and when you need it.
Main Applications
Advanced Packaging
MEMS
FOWLP
2.5D & 3D IC TSV
HBM
TMAP NST3D
The TMAP NST is a non contact full field metrology solution based on optical microscopy enabling surface topography measurements at the nano scale.
The TMAP NST is pushing the boundaries of conventional microscopy with performances that stretch beyond contact profilometry and into the AFM space.
Main Applications
Cu CMP
Hybrid Bonding : Pre/Post Bonding
Front End CMP
Front End Etch
On/Out of plane Overlay
Video Player
INSPECTION SOLUTIONS
LIGHTSpEED
The LIGHTSpEED is the first unpatterned surface inspection solution that combines darkfield inspection and advanced Synchronous Doppler Detection Technology to capture nanometer scale defects on all kind of wafers.
As a part of the modular LIGHTsEE series from UnitySC the LIGHTSpEED can be used as a stand-alone tool or as part of a cluster in combination with other UnitySC technologies such as Phase Shift Deflectometry or brightfield confocal chromatic 2D inspection.
Main Applications
IQC
Process Monitoring
Specialty Substrate
Advanced Packaging
Power
MEMS
LIGHTsEE
The LIGHTsEE, Combo PSD/iEDGE is the leading solution for Power applications to reveal latent defects. It allows to detect sliplines, cristalographic defects as well as particles and contamination.
It also integrates a highly sensitive edge inspection can inspect standard, thin and Taiko wafers. This Combo is a unique solution for Slip lines and nanometer scale defect detection without contact, allowing simultaneous double side inspection.
Main Applications
Epi Inspection
Advanced Packaging
Wafer Thinning
Wafer Maker
Power / IGBT
AOI – Automated Optical Inspection solutions
ODIN
ODIN is a fully automated high-resolution AOI tool for the optical inspection of patterned and non-patterned wafers, their edges and back sides. All these features are seamlessly integrated in one single platform. Advanced 2D- and 3D metrology options for CD, OVL, VIA and film thickness and additional modules for super-fast macro scans (WOTAN) and edge inspection (THOR) enable true all-side wafer inspection and characterization.
Another key feature of this platform is the combined high throughput and high sensitivity, which is unique for automated macro inspection systems on the marketAny defect found can be captured in parallel and in the same run with the help of a built-in high-end microscope with Optics by Carl Zeiss.
Main Applications
True Color Imaging Technology
3D CCS Bump Measurement
Advanced Automasking
Integrated High resolution review µscopy
Probe Mark Inspection
Integrated Metrology for CD/OVL
WOTAN
WOTAN is a fully automated, recipe-free, high-speed AOI tool for simultaneous front and back side inspection. It automatically detects macroscopic defects based on a wafer-to-wafer comparison. Key application is high throughput process monitoring and tool control . Easy-to-read instant result display options allow short correction cycles.
WOTAN is available stand-alone and in combination with edge inspection modules (THOR).
Main Applications
BS Roughness Monitoring
Wafer Signature Detection
Litho Defocus & Tilt Detection
Color Variation Detection
Automated Scribe Line Masking
THOR
THOR is a fully automated, high-speed, high sensitivity AOI tool for edge inspection in all five zones. The built-in edge bead removal (EBR) metrology option allows for precise process monitoring and tool control.
THOR can be incorporated as a module into ODIN and WOTAN platforms to enable true all-side wafer inspection and characterization.
Main Applications
EBR/WEE
Overprinted Edge Inspection
Advanced Defect Binning (ADB)
Wafer Maker
Bonding 3D Packaging
All Edge Zones
AXIOSPECT
Axiospect is a versatile tool family for automatic and manual optical inspection, review and metrology. It’s flexibility comprises vacuum and edge grip wafer handling, optional macro and edge inspection modules as well as metrology options for CD, OVL and film thickness.
Axiospect is the optimal complement to any optical defect inspection system for its automatic defect review ability based on KLARF. The wide range of available optical imaging techniques make it a universal tool for in-line defect engineering. It seamlessly integrates into wafer fab automation and comprises Optics by Carl Zeiss.
Main Applications
Macro Defect Documentation (DEDO)
360° Tilt & Wobble Macro
CD/OVL
FS/BS µScopy
Film Thickness
