Automated Test Equipment

Die Bonder | Wire Bonder | Scriber | Laser tester/stacker | Rework station | Inspection Camera |

Oscilloscopes, Data Loggers, RF and accessories

Environmental test systems: temperature, humidity, corrosion, thermal shock etc

Measurement, Modeling and Design solutions for microwave components, circuits and RF sub-systems.

Flying probe tester manufacturer and active test solution provider. FLYING PROBE TESTER, TROUBLESHOOTING TESTER, AUTO LCR TECHNIQUE

Wafer Vision / Handler, Strip Level Inspection, Tape & Reel Vision / Handler

Semiconductor and FPD Equip: Non-Pattern Surface Inspection System (WM series), Pattern Inspection System (Vi series), Bump Height Inspection System, TSV / Trench Depth Measurement System, Proximity Exposure System (TME series), Visual Inspection System.

Mask/LED/LCD/OLED Laser Repair. Atmospheric SEM, AVI (Auto Visual Inspection) for OLED, TFT AOI

Semiconductor equipment and mobile phone manufacturing automation systems, robots for factory automation, equipment

AI Vision Solution, AOI Solution(DISPLAY/ Secondary Battery/ Semiconductor/ Automobile, etc.), LASER Solution

CHILLER, HEAT EXCHANGER, SCRUBBER, TEST CHAMBER. RETAINER RINGS and OTHER PROCESSING PARTS

Laser processing equipment for semiconductor, display, PCB

Memory Tester, Storage Tester, SoC Tester, Burn-In Tester

Inspection Optic System, Inspection Review Optic system, Laser Repair Optic System, Wafer nano scratch inspection optic system

Semiconductor Equipment (Memory, Logic, Flash, Burn-in-Sorter Test Handler)/ SMD Placement System/ Mask Manufacture Equipment

FPD equipment: Edge Grinder, Edge Profiler, Drilling Machine, Cover Glass Grinder, Mother Glass Grinder. OLED Inspection, Edge Inspection, Various AOI Inspection Equipment. Laser processing equipment. Semiconductor: Loader＆Unloader, FOUP Packing Machine.

Test head manipulators, docking and electrical interface products that are used by semiconductor manufacturers to test integrated circuits and wafers.

Multilayer wiring board (MWB)

Probe cards: MEMSFlex™ Direct Dock, Trio™ Vertical, Vertical Space Transformers, CMOS Image Sensor, LCD Driver, Venture™ Cantilever, Ceramic Blade Cards, MetrologyB3™ Vertical Probe Cards

Parametric electrical tests (E-test), wafer-level and package-level reliability (WLR & PLR), mixed signal tests, assembly and packaging services, probe cards, load boards, test interfaces and sockets.