PHOENIX QUADPRO
Ideal for Fine Pitch (10-100um), MCM, Low-K, Big/Thin Die, Big/Thin Substrate
HIGH UPH
TCNCP Upto 1500 UPH @ 3um
TCCUF Upto 2000 UPH @ 3um
MTD Upto 2500 UPH @ 3um
STD FC Upto 5000 UPH @ 5um
HIGH SPEED BONDING
4 Head Bonding System
Precision Pre-bond Die Centering
Built in Substrate Fluxing
Dip fluxing without cycle time loss
Thermal Application Versatility
HIGH SPEED DISPENSING (Optional)
Upto 2000 UPH @ 50um
Volume Precision Upto +/-5%
Melt and Touch Down (MTD)
High Throughput Thermal Bonding
