St.Blaise, CH Manufacturer
Assembly Automation Technology - dedicated to pick&place, test, inspection and tape&reel processes

Changzhou Mingseal Robot Technology Co., Ltd

 , CN Manufacturer
Dispenser, Vision Dispenser, Cabinet Vision Dispenser, Piezo Jet Valve, Wafer Reinforcement, ASIC Encapsulation, Solder Paste, Wafer Underfill, Smart Production Line, Micro Spot Soldering, Soldering Machine

Tonitec Co Ltd

 , KR Manufacturer
Backend Semicon Equipment: Saw and Place, Pick and Place, L/F loader, Trim/Form/Singulation, Strip/Wafer Mount System, Wafer Taping/Detaping System, Cam Press Trim/Form System. Vision Inspection Systems, Inline Assy System, Ultrasonic Welding System.

Top-A Technology Co., Ltd.

 , KR Manufacturer
Semiconductor Equipment, OVEN, CHAMBER, LED Equipment, LCD Equipment, Connector Tool, Insert Machine, Automobile Part Test Equipment.


 , KR Manufacturer
Semiconductor equipment and ultra-precision automation equipment. Automatic trim, form, load, unload equipment for packaging. Precision mechanical parts

Korea Semiconductor System, KOSES

 , KR Manufacturer,  Custom Manufacturer,  Turnkey Systems Integrator
Solder Ball Attach, Marking System, Laser Drilling, PKG Stack System, Package Laser Saw System, Flux Pre-Cleaning System, Substrate Merge & Sorting System, Loader & Offloader System, Router System, Solder Ball Attach Tool Kit, Pick & Place System


 , CH Manufacturer
Manual and semi-automatic die bonders and pick-and-place systems.

JT Corp.

 , KR Manufacturer
Semiconductor equipment: Test Handler, Vision Inspection, Automation, Laser App. System, Flip Chip Handler, Die Attach System.

Saultech Technology Co., Ltd.

 , TW Manufacturer
Pick and Place, Die attach equipment.

TT Vision Technologies SDN BHD

 , MY Manufacturer
Semiconductor, LED, PV inspection, testing and sorting solutions. Advance robotic solutions.

Ta Liang Technology Co., Ltd

 , TW Manufacturer
IC chip test handler, wafer and reel AOI, CMP pad metrology in-situ monitor. Glass gringing, chmfering machine for FPD, automatic edge coating sysyem for FPD.

TESEC Corporation

 , JP Manufacturer
Discrete Test System, Thermal Resistance Tester, Inductive Load Tester, Dynamic Test System, IPD/IPM Test System, Internal Gate Resistance Tester, MEMS Handler, Film Frame Test Handler, Die Sorter, Gravity Handler, TAB Handler

Semiconductor Equipment Corporation, SEC

 , US Manufacturer,  Distributor
Dicing tapes, wafer mounters, die ejector, pick and place system, die matrix expander, die bonders, FOUP and cassette cleaners

Finetech GmbH & Co. KG

 , DE Manufacturer
Sub-micron and advanced die bonders.

Genesem Inc

 , KR Manufacturer
Semiconductor packaging equipment: WLP marking, film frame mounting, spin coater system. Laser marking, test tape and reel, trim/form and lamination, pick and place, AOI systems. PV cell scribing, singulaition, and stringing system. LED dispensing system.


 , KR Manufacturer
Solder ball placement system, camera module assembly system, semiconductor process automation equipment, package sorting and packing equipment.

BE Semiconductor Industries N.V., Besi

 , NL Manufacturer
Equipment for leadframe, substrate and wafer level packaging applications.

AP Tech

 , KR Manufacturer
Manufacturer of assembly and test equipment for semiconductor, LED, FPD, camera module.

Infotech AG

 , CH Manufacturer,  Custom Manufacturer
Solutions for power module production, die bonding and fluid dispensing. Semiconductor and optoelectronic packaging platforms and cell.