Pick and Place Machine

Dispenser, Vision Dispenser, Cabinet Vision Dispenser, Piezo Jet Valve, Wafer Reinforcement, ASIC Encapsulation, Solder Paste, Wafer Underfill, Smart Production Line, Micro Spot Soldering, Soldering Machine

Backend Semicon Equipment: Saw and Place, Pick and Place, L/F loader, Trim/Form/Singulation, Strip/Wafer Mount System, Wafer Taping/Detaping System, Cam Press Trim/Form System. Vision Inspection Systems, Inline Assy System, Ultrasonic Welding System.

Semiconductor Equipment, OVEN, CHAMBER, LED Equipment, LCD Equipment, Connector Tool, Insert Machine, Automobile Part Test Equipment.

Semiconductor equipment and ultra-precision automation equipment. Automatic trim, form, load, unload equipment for packaging. Precision mechanical parts

Solder Ball Attach, Marking System, Laser Drilling, PKG Stack System, Package Laser Saw System, Flux Pre-Cleaning System, Substrate Merge & Sorting System, Loader & Offloader System, Router System, Solder Ball Attach Tool Kit, Pick & Place System

Manual and semi-automatic die bonders and pick-and-place systems.

Semiconductor equipment: Test Handler, Vision Inspection, Automation, Laser App. System, Flip Chip Handler, Die Attach System.

Pick and Place, Die attach equipment.

Semiconductor, LED, PV inspection, testing and sorting solutions. Advance robotic solutions.

IC chip test handler, wafer and reel AOI, CMP pad metrology in-situ monitor. Glass gringing, chmfering machine for FPD, automatic edge coating sysyem for FPD.

Discrete Test System, Thermal Resistance Tester, Inductive Load Tester, Dynamic Test System, IPD/IPM Test System, Internal Gate Resistance Tester, MEMS Handler, Film Frame Test Handler, Die Sorter, Gravity Handler, TAB Handler

Dicing tapes, wafer mounters, die ejector, pick and place system, die matrix expander, die bonders, FOUP and cassette cleaners

Sub-micron and advanced die bonders.

Semiconductor packaging equipment: WLP marking, film frame mounting, spin coater system. Laser marking, test tape and reel, trim/form and lamination, pick and place, AOI systems. PV cell scribing, singulaition, and stringing system. LED dispensing system.

Solder ball placement system, camera module assembly system, semiconductor process automation equipment, package sorting and packing equipment.

Equipment for leadframe, substrate and wafer level packaging applications.

Manufacturer of assembly and test equipment for semiconductor, LED, FPD, camera module.

Solutions for power module production, die bonding and fluid dispensing. Semiconductor and optoelectronic packaging platforms and cell.