Genesem provides more than 50 types of semiconductor back-end process equipment.
Laser Marking
Different types of marking on product surfaces
Application: 7 areas, including wafers, FPCBs, and packaging
Test Handler
Transfer to semiconductor packaging inspection equipment and
defect detection
Application: packaging area
Inspection
Inspections on foreign materials or patterns on finished products
Application: 5 areas, including packaging and bumps
Pick and Place
High-speed handling and defect detection of various
packaging products
Application: 3 areas, including packaging and EMI shields
