Device Handling and Feeding Systems

automation solutions to improve the productivity of semiconductor package testing. Our automation platforms handle the growing diversity of IC package types and applications resulting from the current environment of mass customization.

Semiconductor IC/component turret packaging machines (semiconductor test handler).

Strip test handlers, film frame handlers, and strip laser marker for the semiconductor industry.

Auto Trim System Auto Form/ Singulation System Side View LED Trim / Form / Singulation System. LCD Glass Inspection System. Vision cropping. Ceramic reflector Sculpture system LED Trim / Form / Singulation System. LED Strip Cutting System. Connector asse

Semiconductor equipment and ultra-precision automation equipment. Automatic trim, form, load, unload equipment for packaging. Precision mechanical parts

Automation equipment for semiconductor, passive components and LED manufacturing process. Dispensers, Die and Wire Bonders, AOI and Measurement, Testers and Sorters.

Semiconductor equipment: Test Handler, Vision Inspection, Automation, Laser App. System, Flip Chip Handler, Die Attach System.

Automation solutions for microelectronics. Taping, Measuring System, Laser Marker, Winding Machine, Autom. Cutting Machine, Testing and Taping Machine, Reloading Machine, IT Tester, Testing Station, Capacity Stacker, Bar Welding Machine.

Semiconductor packaging and testing equipment manufacturer. LED tester and sorter, tape and reel machines.

Molding Systems, Handlers, trim and Form Systems, Stamping and T/F die set.

Auto Guided Vehicles (AGV), L/F inspection machine, laser marking system, dispence system, post mold cure system, rotary test handler, tube to tray handler, tube-to-tube test handler.

Wafer-Level Chip Scale Packaging Inspection & Sort, Integrated Tray-based Scan-Pack, High Speed Tray Taping Machine, Turret-based Scan-Pack Wafer Inspection Machine

Lead trim and form tools. SMT manufacturing equipment

QFN buffing system, auto L/F loader, laser marking, precision molds, dies and other tools for semiconductor.

Semiconductor packaging equipment: WLP marking, film frame mounting, spin coater system. Laser marking, test tape and reel, trim/form and lamination, pick and place, AOI systems. PV cell scribing, singulaition, and stringing system. LED dispensing system.

Solder ball placement system, camera module assembly system, semiconductor process automation equipment, package sorting and packing equipment.

Automatic test equipment for semiconductors, probers, taping machines, test systems, handlers.