Package Handling and Conveying Equipment

Automatic conveying equipment

Semiconductor IC/component turret packaging machines (semiconductor test handler).

BEOL semiconductor equipment: laser marking, wafer inspection, wafer jet deflashing systems, tape and reel machines. Test handlers, pick and place inspection, trim/sort machines,

Production equipment and automation equipment for semiconductors, crystals, LCDs, FILMs, and optical parts.

Auto Trim System Auto Form/ Singulation System Side View LED Trim / Form / Singulation System. LCD Glass Inspection System. Vision cropping. Ceramic reflector Sculpture system LED Trim / Form / Singulation System. LED Strip Cutting System. Connector asse

automatic vision inspection that is dedicated to Semicon backend front of line operations. We have the world's first 3D inspection running in mass production.

SEMICONDUCTOR ROBOTS, FLAT PANEL ROBOTS, CUSTOM & SCARA ROBOTS, LOAD PORTS

Semiconductor equipment: Test Handler, Vision Inspection, Automation, Laser App. System, Flip Chip Handler, Die Attach System.

Semiconductor packaging and testing equipment manufacturer. LED tester and sorter, tape and reel machines.

Molding Systems, Handlers, trim and Form Systems, Stamping and T/F die set.

Ultrasound non-contact end-effectors. Contactless pick-and-place of solar wafers. Contactless substrate handling and inspection.

Auto Guided Vehicles (AGV), L/F inspection machine, laser marking system, dispence system, post mold cure system, rotary test handler, tube to tray handler, tube-to-tube test handler.

Semiconductor assembly & test industry with standalone or integrated package handling, electrical test, inspection, tape & reel etc using our own proprietary technologies

Wafer-Level Chip Scale Packaging Inspection & Sort, Integrated Tray-based Scan-Pack, High Speed Tray Taping Machine, Turret-based Scan-Pack Wafer Inspection Machine

Semiconductor packaging equipment: WLP marking, film frame mounting, spin coater system. Laser marking, test tape and reel, trim/form and lamination, pick and place, AOI systems. PV cell scribing, singulaition, and stringing system. LED dispensing system.

Solder ball placement system, camera module assembly system, semiconductor process automation equipment, package sorting and packing equipment.

Automati optical inspection equipment (AOI) for packaged electronic components and carrier tape.

Automatic test equipment for semiconductors, probers, taping machines, test systems, handlers.

Manufacturer of assembly and test equipment for semiconductor, LED, FPD, camera module.