Camera Module Products
High quality means clean output
Productions of compact camera modules are increasing particularly in mobile phones. PFA, as a pioneer in the industry, has been the market leader with the wide variety of the manufacturing Equipment required for camera modules. We are also contributing to the product quality stability realizing high cleanness as well as high speed/precision.
Active Alignment Bonder (HM-A200)
Active alignment Bonder for dual cameras
(HM-A100D)
ACF/FPC Bonder
4 head multi-dispenser
Holder Mounter (HM-50)
Filter Bonder
Focus Adjustment/Adhesive Application
Customized Equipment
Active Alignment Bonder（HM-A200）
Active Alignment Bonder（HM-A200）
Outlines and Features of ProductsNew Products
Fully automated equipment, that assembles image sensors and lens holder(VCM etc..) with adjusting optical axis. This equipment can finish the processes(Loading-UV resin applying-6 axis adjusting-UV irradiation-Unloading) automatically.
This equipment achieves high speed processing by the triple alignment stage and original focus scaning.
Also, this has twice throughput as conventional HM-A100 has.
Active Alignment Bonder for dual cameras（HM-A100D）
Active Alignment Bonder for dual cameras（HM-A100D）
Outlines and Features of ProductsNew Products
In smartphones, the adoption ratio of dual camera system is increasing, but PFA provide a fully automated device that adjusts the optical axis of the two cameras and fixes them to the bracket.
This equipment can finish the processes(Loading-UV resin applying-6 axis adjusting-UV irradiation-Unloading) automatically.
ACF/FPC Bonder
ACF/FPC Bonder
Outlines and Features of Products
This pastes ACFs and connects FPCs to camera module PCBs. Fully automated equipment that achieves low profile, low temperature and clean connections.
4 head multi-dispenser
4 head multi-dispenser
Outlines and Features of Products
Dispensor that applies dust trap resin and adhesive to camera module board with 4 heads in high speed.
This equipment is compatible with clean class 100.
Also, we manufacture special-order Dipensor that applies to the side and back of the module.
Holder Mounter （HM-50）
Holder Mounter （HM-50）
Outlines and Features of Products
This device applies adhesive to sensor PCBs and then mounts lens holders on them. Accurate mounting beyond that of conventional devices is now possible using image processing compensation and optical linear scale via a pixel-rich camera. We have achieved Class 100 or less by introducing measures for thorough cleanliness.
Filter Bonder
Filter Bonder
Outlines and Features of Products
Bonds and fixes optical filters to lens holders. Adhesive application, bonding filters and temporary UV curing are available under the condition of cleanliness class 100 or less with one equipment unit. Its versatility is remarkable and model change setting is done quite simply.
Focus Adjustment/Adhesive Application Device
Focus Adjustment/Adhesive Application Device
Outlines and Features of Products
This fully automated device adjusts lens focus for camera modules, applies UV adhesive and then performs UV curing as well as housing modules. Items such as focus chart, light source and adjustment software necessary for lens focus adjustment become customer furnished items.
Customized Equipment
We offer various sorts of customized devices, from camera module production devices for smartphones to camera modules for automotive cameras and wearable cameras, etc. Why not contact us to find out.
Examples of Custom Equipment
Wide varieties of adhesive applicators used in module processes
Shield case placer
Glass sealer for CCD/CMOS image sensors
Assembler for wafer-level camera module
Flip chip bonder
bump bonder
Optical axis adjustment devices for dual cameras
Optical axis adjustment devices for stereo cameras
Others
Crystal Devices
A trusted model that leads the industry
Crystal devices are an essential part for every electronic device. PFA supplies high precision equipment to accommodate downsizing of SMD crystal products. Wide lineup from assembling process to inspection and taping, and pursuance of high speed/precision gained many users' support.
Blank Mounter
Curing Oven
Mask Placer
Normal Temperature
Inspection Equipment
High Speed Taping Equipment
Gross Leak Inspection
Equipment
Visual Inspection
Equipment
Frequency Adjustment
Equipment
Blank Mounter
Blank Mounter
Outlines and Features of Products
This equipment applies adhesive on packages for SMD crystal devices and mounts crystal blanks on them, and it is with a tact speed of 0.7 seconds, which puts it among the fastest in the industry. Also, we provide the equipment that mounts the tips that are directly took from the crystal wafer. We have relentlessly pursued revisions to this product in order to improve ease of use and mounting accuracy, which has established it as the top product in the industry since its launch.
Curing Oven
Curing Oven
Outlines and Features of Products
This clean curing oven incorporates a walking beam that uses panel heaters as the heat source. With this N2 curing oven we have achieved a compact equipment offering high-speed temperature rising, soaking and heating. As there are hardly any particles generated, this is the optimum oven for drying and curing conductive adhesive on items such as crystal devices.
Mask Placer
Mask Placer
Outlines and Features of Products
This is a equipment for placing crystal blanks on metal masks used for deposition. The Mask Placer also can be used to transfer to and arrange miniature chips on trays, etc. There are two models in this equipment lineup: one with a tact time of 0.8 seconds and the other 1.5 seconds.
Normal Temperature Inspection Equipment
Normal Temperature Inspection Equipment
Outlines and Features of Products
This performs characteristic inspections on SMD-type crystal devices. Even DLD measuring – the basis of crystal characteristic inspections – has been turned into a high-speed operation because to parallel processing.
High Speed Taping Equipment
High Speed Taping Equipment
Outlines and Features of Products
This performs crystal device printing, print inspection and taping all at high speed. A frequency inspection can be added to as an option. This equipment is particularly good at stably printing, feeding and taping small works.
Gross Leak Inspection Equipment
Gross Leak Inspection Equipment
Outlines and Features of Products
This equipment detects gross leaks in SMD-type crystal units. Using a patented inspection method, the equipment can stably detect leaks even on miniature crystal units as small as size 1612 or less. Moreover, we have designed this equipment to be compact but inspect at a super fast tact time of 0.5 seconds.
(One patent notice of allowance)
Visual Inspection Equipment
Visual Inspection Equipment
Outlines and Features of Products
This equipment inspects for chipping and scratching on the crystal blanks after they have been mounted – thus, automating an inspection process that conventionally requires workers using microscopes. Moreover, we have an option that enables height inspections of blanks and packages.
Frequency Adjustment Equipment
Frequency Adjustment Equipment
Outlines and Features of Products
This equipment adjusts oscillating frequency using a laser to remove tuning fork crystal metallic thin film formed onto wafers. It achieves high throughput by simultaneously measuring multiple numbers of crystal units.
Temperature Inspection Equipment
See the page for Temperature Inspection Equipment for details.
Others
DIP Inspection Equipment
Temperature Test Equipment for TCXO
Temperature Test Equipment for crystal units
Flat Panel Display Products
Flagship models that shape the times
We supply various manufacturing Equipment for liquid crystal and EL display for which the demand is expanding. We have a good track record in our high speed/precision Equipment to meet the ever-increasing demands such as high definition/precision, thinness and lightweight.
Indentation Inspection Machine (AOI)
COG Bonding Machine
FOG Bonding Machine
System Example (Loader, Terminal Washer, COG)
Other custom devices
Indentation Inspection Machine (AOI)
Indentation Inspection Machine (AOI)
Outlines and Features of ProductsNew Products
This equipment performs indentation tests, foreign object defect tests, and position offset tests on LCD panels for COG and FOG mounters. Tests are automatically performed by importing the condition of all terminals as an image using a high-resolution line sensor. The test data is fed back to the COG mounter to facilitate the creation of a high-quality production line. The compact design (width: 800 mm) contributes to saving installation space.
Indentation inspection analysis / Mount position gap inspection
Indentation inspection analysis / Mount position gap inspection
COG Bonding Machine
COG Bonding Machine
Outlines and Features of Products
This is an IC mounting system that automatically bonds ACFs, mounts ICs and final heat bonding onto glass panels. Thanks to our mounting process R&D, we have been able to newly pursue optimization of structure and movement of mechanical parts, in order to achieve high quality, super fast mounters. This means our devices can handle trend work such as narrow edged panels and minutely detailed ICs, whilst also featuring superb operability and optimum data configuration to enable a massive reduction in the time needed to register operation and machine type, which contributes to greater manufacturing efficiency.
FOG Bonding Machine
FOG Bonding Machine
Outlines and Features of Products
This is an FPC mounting system that automatically bonds ACFs, mounts FPCs and final heat bonding onto glass panels. Thanks to our mounting process R&D, we have been able to newly pursue optimization of structure and movement of mechanical parts, in order to achieve high quality, super fast mounters. This means our devices can handle trend work such as narrow edged panels and minutely detailed ICs, whilst also featuring superb operability and optimum data configuration to enable a massive reduction in the time needed to register operation and machine type, which contributes to greater manufacturing efficiency.
System Example (Loader, Terminal Washer, COG)
System Example (Loader, Terminal Washer, COG)
Outlines and Features of Products
With the COG or FOG bonder as the integral device, optional units can be connected to create a desired production style (inline configuration).
Optional Units
Carry in/out conveyor
Loader/unloader
Mid-process stocker
Terminal washer (wet wiping cloth specification)
Terminal washer (wet wiping cloth plus atmospheric plasma irradiation specification)
Indentation inspection machine (AOI)
Ag Paste Dispenser
Other custom devices
Touch Panel Bonder
Others
Temperature Inspection Equipment
Handles both accurate measuring and mass production
Electronic parts used for mobile phones and automotive devices (pressure sensors/intake pressure sensors/atmospheric pressure sensors) require characteristic inspection and adjustment over the temperature change. Various high-precision Temperature Inspection Equipment are available from the high-speed inline inspection equipped Peltier elements to batch type, We also offer equipment to write correction parameters for the device temperature characteristics.
Temperature Characteristic Inspection Equipment
Temperature Inspection Equipment for DIP Inspection
Simple Temperature Characteristic Inspection Equipment
Temperature Characteristic Inspection Equipment
Temperature Characteristic Inspection Equipment
Outlines and Features of Products
This highly accurate, super fast device inspects temperature characteristics for SMD type crystal units. By using a Peltier element for temperature control, we have achieved an even temperature spread. And, by just changing the carrier, various work sizes can be accommodated for measuring. Compared to the conventional inline thermostat chambers, this equipment has been drastically downsized. This Temperature Characteristic Inspection Equipment is available as a three-chamber model or a five-chamber one.
Temperature Inspection Equipment for DIP Inspection
Temperature Inspection Equipment for DIP Inspection
Outlines and Features of Products
Dip inspection Equipment for SMD crystal devices. This Equipment equipped Peltier elements for temperature control and enabled precise temperature characteristic inspection with minimum temperature step of 0.5 ºC in -30 to 85 ºC range. Multiple simultaneous measurements realized a high throughput. Loading and unloading (sorting) are automatically operated.
Simple Temperature Characteristic Inspection Equipment
Simple Temperature Characteristic Inspection Equipment
Outlines and Features of Products
This equipment inspects temperature characteristics for SMD-type crystal units and crystal oscillators. By just changing the tray, various work sizes can be accommodated for measuring. Moreover, this equipment can be used to measure in various ways, so inspection of designs and special work on pieces is easily achieved. This is the optimum equipment for controlling, designing and developing products.
Flip Chip Products
Process technology that enhances mounting quality
Our Lineup;
Flip chip bonder related equipment using ultrasonic which applied crystal oscillator, LED, and SAW filters.
We support customer's rapid productions and processes from our low energy (Eco) equipment.
FC Bonder
Bump Bonder
Precision Dispenser
FC Bonder
FC Bonder
Outlines and Features of Products
This is an FC bonder using US bonding (ultrasonic waves).
The increased efficiency of ultrasonic waves allows bonding at low temperatures and in a short time, to avoid mechanical and thermal residual stress on the product, which in turn enables stable, high quality bonding.
A load/ultrasonic wave head can be chosen according to the application of the material or product. And, thus this bonder can be used for products such as TCXO and SAW filters as well as LEDs and CMOS.
A maximum of 12 wafers can be handled if optional equipment is used.
Bump Bonder
Bump Bonder
Outlines and Features of Products
This equipment is used to form gold stud bumps on various materials.
Our original capillary enables the forming of bumps especially suitable for FC bonding.
And, this equipment supports works within a square of 250mm, achieving a stable bump bonding of high quality.
A maximum of 12 wafers can be handled if optional equipment is used.
Precision Dispenser
Precision Dispenser
Outlines and Features of Products
This is a multipurpose dispenser that implements high-precision application and trace application (over line trace) on works.
High precision image processing (feedback function) achieves stable trace application.
And, detailed partition temperature control for the syringe enables highly accurate dispensing of adhesive.
This fully automated precision dispenser accurately accommodates trace application needs for LED fluorescent materials and underfill materials.
Moreover, if an application head is used, choices are possible. (air type, jet type, mechanical type)
Customized Equipment
Realization of a new process
We provide equipment for customer specifications. Utilizing our expertise such as implementation and temperature inspection technologies for continuously emerging new consumer and automotive electronic devices and environment related products. We have a successful track record in designing and manufacturing equipment such as CF bonders for solar cells, assembly & inspection equipment for capacitors, temperature testers for sensors and chip mounters. Please contact us for details.
Custom Equipment Examples
CF Bonder for Solar Cells
Assembly Equipment and Inspection Equipment for Capacitors
Assembly Equipment and Inspection Equipment for MEM Sensors
Laser Adapting Equipment (welding and trimming devices, etc.)
Customized Die Bonders
handler of Image sensor
High-speed equipment for high luminance LEDs
LED Chip Sorter
LED Chip Prober
High-speed equipment for high luminance LEDs
LED demand such as for lights and backlights is rapidly increasing due to its energy saving and long life characteristics.
PIONEER FA supplies products ahead of the requirements of the time such as chip inspection Equipment and production Equipment for super luminosity LED.
LED Chip Sorter
LED Chip Sorter
Outlines and Features of Products
This is a sorter that rearranges chips based on rank-sorting data created by the LED Chip Prober. LED packages from square 200μm to 3 mm are rearrangeable. Two multi-pickup heads with 12 heads each increase sorting speed, and the sorter achieves high-precision positional accuracy by performing image-based position correction.
LED Chip Prober
LED Chip Prober
Outlines and Features of Products
A equipment that stably inspects the electrical and optical characteristics of LEDs with high precision and at high speed.
Extremely accurate light intensity measurements are possible through a construction that enables measurements of top surface and bottom surface emitted light at wide angles. The effect of transient characteristics, which is a problem with short pulse measurements, has been eliminated by stabilizing the measurement timing. Inspections are possible in the industry's fastest time of 100 ms with the cam drive and compact cross table. (Pioneer FA-designated measurement conditions) The LED Chip Prober demonstrates its maximum performance when combined with our LED Chip Sorter.
