Flip Chip
What are IC Package Substrates?
IC Package Substrate
An IC package substrate is a significant part working in conjunction with IC chips, whose added values are increasing to match more advanced semiconductor performance.

Conductor Patterning Technology to Enable Ultra-Fine Wiring
With a focus on SAP (Semi Additive Process), we provide the world-class micro patterning. We are also promoting the development of conductor patterning technologies of semiconductor revel toward future.

Micro-Via with High Connection Reliability
Micro-Via that connects between layers is one of the most important elements of IC package substrates. With our unique alignment technique and state-of-the-art lasing and metal planting technologies, we realize Micro-Via boasting not only connection reliability but also electrical characteristics.

MPU for PC and Data Center, Semiconductors: GPU for AI and Vehicles


Graphite Specialty
What are Graphite Specialty Substrates?
What are Graphite Specialty Substrates?
Compared with metallic materials, graphite has layered crystal structures, which features lightweight, high thermal resistance at 3000 deg C and dimension stability.

High Purity Graphite
We manufacture and sell high purity graphite in our plants adopting high quality coke and pitch. We can also provide superior purity products specially treated by removing metal impurity.

Our Unique Technique of Surface Treatment and Adhesion
Our PYROCARB maintains excellent graphite characteristics by adding features of high purity and airtightness as vacuum evaporated carbon surface. It is used not only for single crystal pulling devices for semiconductors but also over 5m parts and complicated materials with the adhesion technique.

Single crystal pulling apparatuses for Silicon and SiC, Auto and aviation electric discharge machining electrode, Industrial materials for continuous casting and industrial furnaces