Fillgold Group Corporation is a high-tech enterprise engaged in the design and production of leadframe,IC substrate,precision metal parts in PCBA,We are adhering to the characteristics of multi-species,high quality,and quick turn around.Our company was founded in 2012 and the headquarter is in Zhuhai.Our factory is more than 30,000 square meters for meeting mass production need,the most basic production processes are as follows:stamping,precision grinding&polishing,CNC,chemical etching,plating,etc.With accurate market positioning, customer-centered service and exploration spirit,Fillgold has gradually grown into a well-established enterprise.In Fillgold Group,there are three business divisions:Fillgold,Allshare and Highrise.The future goal of Fillgold technology is to build the largest rapid production platform for PCBA's precision metal parts, such as 3D steel sheets, heatsinks, shielding,etc. Meanwhile, Allshare is focusing the personalized one-stop solution to leadframe. In addition,Highrise provides advanced manufacturing of IC Substrate and various technical services. We are providing good quality service for many well-known companies both at home and abroad, and our products are widely applied worldwide in many fields, specially in telecom, computer, industrial control, power, medical,automotive electronics,etc.