Etched Lead Frames

LED Lead Frames, Discrete, Transistor, IC Lead Frames, VFD Frame, BGA Heatsink, FPC

Integrated circuit enterprise, which sets lead frame, module packaging, wafer thinning, dicing and testing as one

Etched lead frames and custom metal parts.

Lead frames, TO- headers, ceramic packages, stamping and molding dies, press mold equipment.

Transistor and power transistor lead frames. SOT/ SOD Lead Frame, IC, LED L/F.

IC L/F QFJ, SOJ, TQFP, LQFP, QFP, TSOP, SSOP, SOP, ZIP, SDIP, DIP, QFN. LED Lead frames. Graphite / Cu+Film.

RF/EMI shields, screens, contacts, connector housings, lead frames, apertures, laser cut SMT stencil

Thermal management products. Lead frames and other stamping and etching products.

Lead frames. Service: precision etching, precision stamping, precision machining, surface treatment.

Etched lead frames and metal parts

Chemical etching and precision stamping products

Stamped and etched lead frames

Leadframe, IC substrate, precision metal parts in PCBA

Metal heating film, IC L/F, metal meshwork, VFD meshwork, computer magnetic spring, mobile accessories, silver jigs, metal code plate, FPC patch steel plate, steel spring of printer etc. The main technologies include precise etching, precise stamping.

Etching services. IC Lead Frame, Vapor Chambers, Bipolar Plate, Kovar Lid

Lead frames, riveted L/F, power module L/F, stamping die mold, pre-molded open cavity packages, contact pins

Precision lead frames for IC and semiconductor packages.

Lead frames: QFN, High Density TQFP, LQFP, PQFP (Triple, Dual, Matrix Format) SOIC, TSSOP, TSOP, MSOP, QSOP, SSOP, PDips, PLCC, Micro Packages in Matrix Format (SOTs / SC)

Lead frames: HD-BU, HDL, PDIP, PLCC, QFN, QFP, TSOP/LOC, SOIC, Thermal Enhanced.

Thermal Heat Spreader, Semiconductor Leadframe, SMD LED Leadframe, EMI Sheilding Case, RF coaxial connector, DPC Thin-film Ceramic Substrate Components