The lead frame is a metal substrate that supports the semiconductor chip, which connects external electrodes and supports the semiconductor package to secure the electronic circuit board.
The plating and surface treatment of lead frames is progressing day by day to meet the ever-increasing mounting density of semiconductor packages and chip performance.
Recent plating technology, Micro PPF (ultrathin gold-plated), Roughness, improved adhesion between the package and the lead frame such as Spot, proceed with the plating only small areas to ensure competitive prices.
In addition, plating to simplify the post-process is gradually spreading.
Product Type
QFJ, SOJ, TQFP, LQFP, QFP, TSOP, SSOP, SOP, ZIP, SDIP, DIP, QFN, etc
Plating specification
Ag Selective / Ag Full / Ag Spot / Ni+Sn / NiNiP / Sn
Respond to customer requirements
LED Frame
> Business > LED Frame
Product Type
3030, 3528, 3735, 3924, 5050, 7020, etc
Plating specification
Ni & Cu Underlayer + Ag
Respond to customer requirements
