Fans, Thermal Management

Sputtering Targets, Gilding Materials, Conductive Pastes.

Packaging and bonding materials in the semiconductor and electronics field.

Special polymer materials for electronics

IC L/F QFJ, SOJ, TQFP, LQFP, QFP, TSOP, SSOP, SOP, ZIP, SDIP, DIP, QFN. LED Lead frames. Graphite / Cu+Film.

Thermal management products. Lead frames and other stamping and etching products.

Lead frames: HD-BU, HDL, PDIP, PLCC, QFN, QFP, TSOP/LOC, SOIC, Thermal Enhanced.

Thermal Heat Spreader, Semiconductor Leadframe, SMD LED Leadframe, EMI Sheilding Case, RF coaxial connector, DPC Thin-film Ceramic Substrate Components

Potting material, Jelly Gel, Sealant & Adhesive, Thermal Conductity, Conformal Coating, ALubrication Grease

Electrically conductive adhesives, Thermally conductive adhesives, Thermal greases, Thermal Gap-fillers, Underfill, Glob top, Dam & Fill encapsulants, UV-curable adhesives, Potting resins.

LM-Lid, which perfectly resolves the TIM1 issue when cooling IC chips in lidded flip chip packages

Electronic Adhesives, Inks, Pastes and Coatings

Underfill Materials, Die Attach Adhesives, Wafer Level Materials, Optoelectronic Materials, Conformal Coatings.

Non-Silicone Thermal Grease, dry-to-the touch thermal grease pads, GAP material, High thermal conductivity, low thermal resistance.

Adhesives, potting and encapsulation products for semiconductors and electronics.

LCD fine particles, photosensitive materials, semiconductor materials, optical film, industrial tapes

Cooling systems. Power Systems. Servo Systems

Chip heatsinks, glass products. Silicon, metal, sapphire and ceramic products for semiconductor.

THERMAL CONTROL SOLUTION FOR THE SEMICONDUCTOR TEST INDUSTRY

Cearmic packages for SAW, XTAL, OSC. Glass-to-metal seals. Ceramic wire bonding capillaries. AlN, Al2O3 substrates, nano zirconia powder.

Lead frames, glass-to-metal seals, package substrates, ceramic wafer chucks, heat spreaders and micro heatpipes.