Heatsinks for optical communication, industrial laser, power semiconductor devices, MPU, etc.
Insulation type Cu-AlN-Cu submounts
High pressure seamless microchannels
Glass products for display devices for projectors, sensors, mobile devices, semiconductors, biotechnology/medical equipment, etc.
Through glass via (TGV)
Drilling tool Products
Significant improvement in longevity of processing quality made possible by all-blade core drill
Metal and ceramic products such as Si, Al2O3, Al, Sapphire, etc.
Silicon wafer for dicing test