We have successfully commercialized the world's highest performance copper-diamond composite material with a thermal conductivity of 1000W/mK. We are developing products that meet customer needs and creating new value, especially in applications such as CPU components, 5G/6G wireless communications, EVs, and AI. As a result, we are providing heat spreaders for semiconductor packages with the world's highest performance to global customers.
arCuDia CPU 4035(Cu-Diamond Components for CPU Packages)
CPU components using Cu-Diamond composite with 1000W/mK thermal conductivity
◈ Applied to Intel's latest CPU to reduce maximum temperature by 12℃ and improve performance
◈ intel CORE i9-13G 13900K (Raptor Lake) performance : 38305 42281 points achieved (CINEBENCH score)
arCuDia, SbS-Dia Heat spreader for extreme applications
SbS8% 1010
Heat spreader for RF device
SbS16% 1020
Heat spreader for RF device
SbS16% 1724
Heat spreader for RF device
SbS16% 3080
Heat spreader for electrical vehicle
SbS21% 1030
Heat spreader for RF device
SbS32% 40100
Heat spreader for electrical vehicle
SbS8% 1010
Heat spreader for RF device
SbS16% 1020
Heat spreader for RF device
SbS16% 1724
Heat spreader for RF device
SbS16% 3080
Heat spreader for electrical vehicle
SbS21% 1030
Heat spreader for RF device
SbS32% 40100
Heat spreader for electrical vehicle
CNG Products
