The National Center for Advanced Packaging (NCAP China), registered in Wuxi, China in 2012, is a joint venture established by several investors, including the leaders of the IC packaging and testing industry in China, and the Institute of Microelectronics of Chinese Academy of Sciences.

As a national center for advance packaging, testing and system integration, NCAP, in collaboration with system OEM’s and supply chain partners, aggressively pursues research and development in order to offer total solutions for the IC industry. NCAP’s current research directions include: 2.5D/3D technology (including TSV), high density wafer level packaging, SiP product development capabilities, and certain advanced materials and equipment technologies for microelectronics packaging.

The company has been established for 7 years
In recent years, NCAP has undertaken 16 science and technology projects (including National Science and Technology Major Project, 973 project, 863 project, National Natural Science Foundation project, and projects of province and city) and served for hundreds of companies (companies from Jiangsu accounting for 1/3) .

Up to the end of 2018, 724 patents have been applied, including 658 invention patents and 28 international patents, and 282 invention patents and 12 international patents have been issued.


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