Electronic System Design

Assembly and Design Solutions for Silicon Photonics, LiDAR, SiP, MCM Modules, IoT Sensors, Medical, Telecom, 5G RF and Commercial Applications

OSAT. Semiconductor packaging and testing service.

AI ASIC solution provider

IC Packaging Service, Open Cavity Packages, Test Socket, Polyimide(PI)

Quick turn semiconductor modification solutions. Robotic Hot Solder Component Tinning, Component Solder Ball Removal and Replacement, Component Tape and Reel Packaging Services, Component Bake and Dry Pack Services.

Reliability, Reliability Test, Quality Test, Failure Analysis, Analysis, R&D, Test, Life Test

OSAT. Semiconductor packaging and testing service.

OSAT, semiconductor packaging and testing. Test : Memory, SoC, CIS, RF, PMIC (Wafer and Package Test)

PACKAGE ASSEMBLY, BALL- WEDGE- RIBBON BONDING FLIP CHIP BONDING, TEST AND DESIGN SERVICES

MEMS foundry

SiGe:C BiCMOS foundry, special integrated RF modules and integrated silicon photonics with >60GHz bandwidth photodiodes. IP cores

Superconductor integrated circuits (ICs)

Photonic components, modules and subsystems. customizing our core photonic technology in Indium Phosphide, Gallium Arsenide or Silicon, we will be happy to provide a private label solution to support your needs.

Custom analog mixed-signal IC design and CMOS image sensor technology

program management and customized solutions for high-complexity products with low to medium volume production. ASIC design, CMOS and MEMS foundry support

Custom ICs, sub-systems, or IP blocks.

Provider of product engineering and semiconductor design services.

ASIC DESIGN HOUSE, CONSULTING, ELECTRONIC DESIGN CENTER, BENCHMARK RADIATION TEST

Engineering Service Provider with a cutting edge focus on the development and design of ASICs, SoCs, FPGAs, Embedded Software and discrete Systems.

Customized compound semiconductor photonic, RF and wireless devices. Foundry & Design Services.