The company is located in Shanghai Pudong Zhangjiang Hi-Tech Park and Shanghai Songjiang District Tus Caohejing Hi-Tech Park , with advanced semiconductor packaging, testing, verification and other equipment and experienced work teams, mainly providing advanced packaging substrate design, simulation, processing, MEMS sensor/optical device packaging design and processing, professional Wafer/MPW thinning, dicing, automatic chip sorting, rapid packaging (ceramic & plastic packaging production lines), reliability RA testing, FIB , competitiveness analysis, testing, etc. Technical analysis and testing services, currently has 55 patents, GB/T19001-2016/ISO9001:2015 , ISO45001:2018 , GB/T24001
Rapid Plastic Encapsulation Sheet
LQFP plastic packaging series Number of pins LQFP32/44/48/64/80/100/128/144/176/208/216/256
Outer Dimensions (mm) 5*5/7*7/10*10/12*12/14*14/20*20/24*24/28*28
eLQFP plastic packaging series
(with heat sink)
Number of pins HLQFP80/128/144/176
Outer Dimensions (mm) 12*12/14*14/16*16/20*20
QFN plastic packaging series Number of pins QFN12/16/20/24/28/32/40/48/56/64/68/76/88/100
Outer Dimensions (mm) 2*2/3*3/4*4/5*5/6*6/7*7/8*8/9*9/10*10/12*18
DFN plastic packaging series Number of pins DFN8/10/12/14/16
Outer Dimensions (mm) 2*3/3*3/3*4/5*6/2.4*2.4
DIP plastic packaging series Number of pins 8, 12, 14, 16, 20, 24, 28, 40, 48
SOP plastic packaging series Number of pins 8, 10, 14, 16, 20, 24, 28, 32
SSOP plastic packaging series Number of pins 8, 16, 20, 24, 28
TSSOP plastic package series Number of pins 8, 14, 16, 20, 24, 28, 30
eSOP plastic packaging series Number of pins 8, 10, 28
MSOP plastic package series Number of pins 8, 10
TO plastic packaging series Number of pins 90, 94, 220, 247, 251, 252, 263
SOT plastic sealing series Number of pins 3, 5, 6
