One stop service of a substrate Packaging experimental production and mass production!
We will be consistent, and handle a substrate design, part supply, packaging, assembly and quality evaluation/the guarantee and packing/shipment about wire bonding, the bare chip packaging of ACF, FCB and SMT.
An experimental production and a little mass production (10 unit) will correspond.
We will handle it from dice cutting of an IC chip, tray loading and the back grind. we also receive the modularizing.
We will handle rework from 1 wire/a repair.
We are able to continuous production of a flat-panel display (design, supply, lamination, packaging and check)
We will handle it from 1 panel.
We will also correspond to mass production.
We will respond to a short due date.
We will handle modularizing after the lamination.
Possible panel
A liquid crystal panel: Low temperature, hotness and amorphous polysilicon
OLED: low temperature polysilicon
Touch panel glass and film
Electronic paper: low temperature polysilicon, and FPD in general
Our corresponding process
driver implementation (COG / COF)
FPC implementation with ACF connection
lamination of polarized film
assembly of backlight
direct bonding
light up inspection
others
