Technology transfer and licensing

Nanoimprint lithography (NIL) tools, resists, masks, and processes for a variety of NIL including thermal and photo-curable NIL, as well as direct imprinting of materials.

Photonic Integration Consultancy, PIC Design, PIC Manufacturing, Characterization and testing services at wafer and chip (DIE) levels, PIC Packaging, Foundry Process Design Kits, PIC Design and Characterization

iPronics develops the innovative concept of Field Programmable Photonic Gate Arrays (FPPGAs), which are based on a common optical hardware configurable through software to perform multiple functions.

Flexible integrated circuits (FlexICs) are thinner than a human hair and can be invisibly embedded in objects, enabling innovators to create novel solutions to everyday problems that are not practical with conventional electronics.

A complete deposition system provider for the organic material layers within the OLED stack. APEVA operates its strategic organic vapor deposition technology (OVPD) out of its location in Herzogenrath, Germany

Closed process chain concept and process development, characterization, reliability assessment and prototyping of 3D systems. All processes required throughout the chain for the realization of wafer-level packages, including through silicon via (TSV)

Technologies for high-purity materials: oxide (Ge, P, and rare earth elements) doping quartz fiber light guides; optical elements based on polycrystalline zinc chalcogenides for power IR optics, CdHgTe MOCVD technology for photodetectors

π-Fab - Prototype Fabrication, SiC-Services, Failure Analysis, Trouble Shooting in Power Electronics, Equipment and processes for the production of crystalline bulk and layer materials for electronics, comprising silicon, wide-band-gap semiconductors.

Nanostructure fabrication technology that enables us to develop process technology and application concepts to solve advanced materials engineering problems within several industrial sectors.

method for manufacturing semiconductor components with a high degree of packing, which eliminates several steps in the manufacturing process - Atomic Layer Etch Pitchsplitting (APS).

Next generation of transistors. The nanowire transistors are fabricated by combining well-established technologies and materials

CSEM is a Swiss private, non-profit research and technology organization with +35 years of Deep Tech development and transfer to industry.

III-V lab offers pre-commercial and customized production of III-V components or epitaxy wafers (MBE, MOVPE) for innovative products. advanced modeling to transfer to production in the field of III-V SC (GaAs, InP, GaN) and their integration on Si.

research in nanoelectronics

Design management solutions for SoC, IP, IC and software design

IP and technology transfer. Flip-chip technologies include the Copper Pillar Bump, Molded Interconnect Substrate, No-Flow Underfill, and flipchip packaging methods and structures including flipchip on leadframe and substrate packages.

Integrated edge AI hardware and software solutions for vehicle, security, and broader AIoT use cases.

Thin film substrates: Thin film RDL on 12” glass, 2.2D thin film integrated substrate. Substrates and process for 2.0D, 2.1D, 2.2D, 2.3D, and molded thin film RDL technology know-how and IP licensing.

economic oriented research to advance scientific discovery and develop innovative technology.

Association of more than 350 companies, universities and research institutions of the microelectronic field in Saxony (Germany)