Nanonex Corp

 , US Manufacturer
Nanoimprint lithography (NIL) tools, resists, masks, and processes for a variety of NIL including thermal and photo-curable NIL, as well as direct imprinting of materials.

VLC Photonics

 , ES Manufacturer
Photonic Integration Consultancy, PIC Design, PIC Manufacturing, Characterization and testing services at wafer and chip (DIE) levels, PIC Packaging, Foundry Process Design Kits, PIC Design and Characterization

iPronics, Programmable Photonics

 , ES Manufacturer
iPronics develops the innovative concept of Field Programmable Photonic Gate Arrays (FPPGAs), which are based on a common optical hardware configurable through software to perform multiple functions.

PragmatIC Semiconductor Limited

 , GB Manufacturer
Flexible integrated circuits (FlexICs) are thinner than a human hair and can be invisibly embedded in objects, enabling innovators to create novel solutions to everyday problems that are not practical with conventional electronics.


 , DE Manufacturer
A complete deposition system provider for the organic material layers within the OLED stack. APEVA operates its strategic organic vapor deposition technology (OVPD) out of its location in Herzogenrath, Germany

Fraunhofer Institute for Reliability and Microintegration IZM

 , DE Manufacturer,  Service Company
Closed process chain concept and process development, characterization, reliability assessment and prototyping of 3D systems. All processes required throughout the chain for the realization of wafer-level packages, including through silicon via (TSV)

FSBIS Institute of Chemistry of High-Purity Substances. G. G. Devyatykh of the Russian Academy of Sciences

 , RU Manufacturer
Technologies for high-purity materials: oxide (Ge, P, and rare earth elements) doping quartz fiber light guides; optical elements based on polycrystalline zinc chalcogenides for power IR optics, CdHgTe MOCVD technology for photodetectors

Fraunhofer Institute for Integrated Systems and Device Technology, IISB

 , DE Manufacturer,  Service Company
π-Fab - Prototype Fabrication, SiC-Services, Failure Analysis, Trouble Shooting in Power Electronics, Equipment and processes for the production of crystalline bulk and layer materials for electronics, comprising silicon, wide-band-gap semiconductors.

Smoltek Semi AB

 , SE Service Company
Nanostructure fabrication technology that enables us to develop process technology and application concepts to solve advanced materials engineering problems within several industrial sectors.

AlixLabs AB

 , SE Service Company
method for manufacturing semiconductor components with a high degree of packing, which eliminates several steps in the manufacturing process - Atomic Layer Etch Pitchsplitting (APS).

NordAmps AB

 , SE Service Company
Next generation of transistors. The nanowire transistors are fabricated by combining well-established technologies and materials


 , CH Manufacturer,  Custom Manufacturer,  Service Company
CSEM is a Swiss private, non-profit research and technology organization with +35 years of Deep Tech development and transfer to industry.

III-V Lab, France

 , FR Manufacturer,  Custom Manufacturer
III-V lab offers pre-commercial and customized production of III-V components or epitaxy wafers (MBE, MOVPE) for innovative products. advanced modeling to transfer to production in the field of III-V SC (GaAs, InP, GaN) and their integration on Si.


 , BE
research in nanoelectronics

IC Manage

 , US Service Company
Design management solutions for SoC, IP, IC and software design

Advanpack Solutions Pte Ltd

 , SG Manufacturer,  Service Company
IP and technology transfer. Flip-chip technologies include the Copper Pillar Bump, Molded Interconnect Substrate, No-Flow Underfill, and flipchip packaging methods and structures including flipchip on leadframe and substrate packages.

Kneron, Inc.

 , US Manufacturer,  Service Company
Integrated edge AI hardware and software solutions for vehicle, security, and broader AIoT use cases.

SiPlus Co., Ltd

 , TW Manufacturer
Thin film substrates: Thin film RDL on 12” glass, 2.2D thin film integrated substrate. Substrates and process for 2.0D, 2.1D, 2.2D, 2.3D, and molded thin film RDL technology know-how and IP licensing.


 , SG
economic oriented research to advance scientific discovery and develop innovative technology.

Silicon Saxony e.V.

 , DE
Association of more than 350 companies, universities and research institutions of the microelectronic field in Saxony (Germany)