Nano Quarz Wafer GmbH
Langenzenn, DE Manufacturer, Distributor
Manufacturer and supplier of LiNbO3, LiTaO3, fused silica, quartz, SOI and silicon wafers.
Hyrel Incorporated
, US Manufacturer, Service Company
Quick turn semiconductor modification solutions. Robotic Hot Solder Component Tinning, Component Solder Ball Removal and Replacement, Component Tape and Reel Packaging Services, Component Bake and Dry Pack Services.
Biotronics, Inc
, US Manufacturer, Custom Manufacturer
MEMS Technology facilitating company that primarily provides a broad range of semiconductor foundry services. We largely support Silicon, Silicon Carbide, Aluminum Nitride, Gallium Arsenide substrates.
Entrepix, Inc
, US Manufacturer, Service Company
OEM for new OnTrak cleaners. Upgrades, obsolescence solutions, sub-assemblies, and complete electro-mechanical systems for CMP-style polishing and cleaning. CMP Foundry.
CINOS Co Ltd
, KR Service Company
Cleaning and coating services to major domestic semiconductor
Capital Semicon Technology Suzhou Co.,Ltd
, CN Manufacturer
R & D and production of stainless steel, aluminum alloy, engineering plastic parts, surface treatment, anode oxidation, chemical cleaning, film, stainless steel passivation, electrolytic polishing and dust-free packaging, regeneration cleaning.
Intlvac Thin Film Corporation
, US Manufacturer, Service Company
Customized systems for Thin Film PVD and Etch. Small R&D/pilot project systems, large production systems utilizing processes such as Ion Beam Etching, Sputtering, Electron Beam Evaporation and Thermal Evaporation fiber-optic coating and more.
IND, Inc
, US Service Company
Services: Critical Clean, Robotics, Ion Implant, Metrology, Laser Scribing, Field Services. Coatings: Powder Coatings, Gold & Nickel Plating, Thermal Spray, Anodizing, Yttira
Mitomo Semicon Engineering Co., Ltd.
, JP Manufacturer
CONNECTOR PLATING EQUIPMENT WAFER PLATING EQUIPMENT PLATING EQUIPMENT FOR SQUARE SUBSTRATES ELECTROLYTIC ETCHING EQUIPMENT CARRIER TYPE PLATING EQUIPMENT LEADFRAME SHORT PLATING EQUIPMENT
WUXI HUAJING LEADFRAME CO.,LTD.
, CN Manufacturer
IC, LED and power descrete lead frames
Advanced Assembly Materials International Ltd, AAMI
, HK Manufacturer
Lead frame products and material solutions to the semiconductor packaging industry
Metrigraphics LLC
, US Service Company
Manufacturer of micron-scale thin film circuits and electroformed components.
Tosetz Inc.
, JP Manufacturer
Plating Process solutions, Gas Abatement Systems, Deaeration Systems, Wet Process Tools, Process Support & Consulting
DISCO Corporation
, JP Manufacturer
Precision Machines: Dicing Saws, Laser Saws, Grinders, Polishers, Wafer Mounter, Die Separator, Surface Planer, WaterJet Saw. Precision Processing Tools: Dicing Blades, Grinding Wheels, Dry Polishing Wheels.
Advantiv Technologies, Inc.
, US Distributor, Service Company
Wafer, Material, Vacuum, Power Quality, Smart Industry, Clean Energy Solutions
Nano Electronics and Micro System Technologies, Inc.
South District, TW Manufacturer, Service Company
NEMS develops plasma technologies and provides plasma surface treatment solutions, including vacuum and atmospheric plasma machines. NEMS plasma machines can be used for surface cleaning surface etching and surface modification
Nanmat Technology Co., Ltd.
Kaohsiung City, TW Manufacturer, Custom Manufacturer, Service Company
Development, production and sales of chemical vapor deposition (CVD/ALD) precursors, sealants and metal coating chemical products, processes and services.
KoMiCo Ltd.
, KR Service Company
Cleaning and coating service for semiconductor parts.
Singapore Epson Industrial Pte Ltd
, SG Service Company
Plating Technology for Microelectronics, Under Bump Metalisation (UBM), Plating Technology for Wafers and RF Packages.
Toyo Advanced Technologies Co., Ltd.
, JP Manufacturer
Tools and Equipments related to semiconductors and power semiconductors. CVD and PVD coatings.Numerical control devices for machine tool.