Plating; Electro Polishing; Coating; Surface Treatment

Quick turn semiconductor modification solutions. Robotic Hot Solder Component Tinning, Component Solder Ball Removal and Replacement, Component Tape and Reel Packaging Services, Component Bake and Dry Pack Services.

MEMS Technology facilitating company that primarily provides a broad range of semiconductor foundry services. We largely support Silicon, Silicon Carbide, Aluminum Nitride, Gallium Arsenide substrates.

OEM for new OnTrak cleaners. Upgrades, obsolescence solutions, sub-assemblies, and complete electro-mechanical systems for CMP-style polishing and cleaning. CMP Foundry.

Cleaning and coating services to major domestic semiconductor

R & D and production of stainless steel, aluminum alloy, engineering plastic parts, surface treatment, anode oxidation, chemical cleaning, film, stainless steel passivation, electrolytic polishing and dust-free packaging, regeneration cleaning.

Customized systems for Thin Film PVD and Etch. Small R&D/pilot project systems, large production systems utilizing processes such as Ion Beam Etching, Sputtering, Electron Beam Evaporation and Thermal Evaporation fiber-optic coating and more.

Services: Critical Clean, Robotics, Ion Implant, Metrology, Laser Scribing, Field Services. Coatings: Powder Coatings, Gold & Nickel Plating, Thermal Spray, Anodizing, Yttira

　CONNECTOR PLATING EQUIPMENT 　WAFER PLATING EQUIPMENT 　PLATING EQUIPMENT FOR SQUARE SUBSTRATES 　ELECTROLYTIC ETCHING EQUIPMENT 　CARRIER TYPE PLATING EQUIPMENT 　LEADFRAME SHORT PLATING EQUIPMENT

IC, LED and power descrete lead frames

Lead frame products and material solutions to the semiconductor packaging industry

Manufacturer of micron-scale thin film circuits and electroformed components.

Plating Process solutions, ​Gas Abatement Systems, ​Deaeration Systems, ​Wet Process Tools, ​Process Support & Consulting ​

Precision Machines: Dicing Saws, Laser Saws, Grinders, Polishers, Wafer Mounter, Die Separator, Surface Planer, WaterJet Saw. Precision Processing Tools: Dicing Blades, Grinding Wheels, Dry Polishing Wheels.

Wafer, Material, Vacuum, Power Quality, Smart Industry, Clean Energy Solutions

NEMS develops plasma technologies and provides plasma surface treatment solutions, including vacuum and atmospheric plasma machines. NEMS plasma machines can be used for surface cleaning surface etching and surface modification

Development, production and sales of chemical vapor deposition (CVD/ALD) precursors, sealants and metal coating chemical products, processes and services.

Cleaning and coating service for semiconductor parts.

Plating Technology for Microelectronics, Under Bump Metalisation (UBM), Plating Technology for Wafers and RF Packages.

Tools and Equipments related to semiconductors and power semiconductors. CVD and PVD coatings.Numerical control devices for machine tool.