KoMiCo offers advanced cleaning and coating technology and quality assurance services to minimize damage on high-function equipment components in the contaminants removal process and to increase equipment efficiency.
Cleaning of KoMiCo is a process to remove contaminants such as particles and ionic impurities of equipment parts generated during customers' process. We also provide various solutions to maintain and control the surface of damaged parts to meet each process requirement by minimizing damage of basic material, removing process contaminants, increasing product life, improving uniformity and controling micro contamination.
nitial stage of cleaning
Introduced semiconductor parts cleaning
technology for the first time in Korea
Precise cleaning per material and process
Improvement of physical
cleaning technology →
CO2 Cleaning, Bead, Arc Coating
0.3 ㎛ Size Particle Control
Optimization
of products
surface treatment
Improved various physical cleaning technologies →
Improved the surface suitable for various needs of customers
Cleaning processes on products with various functions & composite materials
Precision of cleaning
0.1μm Size Particle control
Introduction of
Nano cleaning technology
Optimization of surface treatment →
Improvement of process yield
Reduction of Particle source by increasing surface area per product
Precision of cleaning process →
Introduction of quality management system
0.04㎛ Size Particle control
Evolution of Nano cleaning technology
SMART Factory – Automation
Application of flexible recipe per product
Control of micro process → Reduction of process defect of customers
Development of eco-friendly cleaning technology
Increase of product life and decrease of delivery time
0.01um Size Particle Control
Major cleaning technology
KoMiCo provides proper cleaning technology for various processes and parts of our customers. In addition to eliminating process contaminants, we are constantly researching and developing to provide optimal solutions to control the particles and maximize products' life through the best surface conditions for any parts.
CuStrip™ CleanPeel™ SurFinish™ SurfRestore™
Purpose of use Removal process of contaminants by minimizing the damage of the basic material of parts at the Cu process Improvement of parts life time by minimizing parts damage Reduction of Al CVD Showerhead basic materials and hole damage Restoration of plasma etching surface damage of quartz material products
Effect Reduction on the etch rate of basic materials Extension of parts life time Extension of parts life time Particle Source Reduction
Maintenance of gas flow uniformity Particle improvement
Extension of parts life time
Products Al Collimator,
AlCoverRing etc. Products such as PVD Process Shield CVD Process Showerhead Quartz Window,
Quartz pedestal, etc.
Effect
