Capabilities
When it comes to design engineering, prototyping, process development, and mass production of micron-scale circuits and components that combine ultra-miniature feature size, tight tolerances, and high reliability, we're the team innovators turn to. We're also specialists in applying the circuits to flexible polyimide substrates for next generation electrical, RF and bio sensor devices.
Whether it’s developing nozzle plates for the next generation of high-end, large-format printers, creating millions of sensors for large medical OEMs, or working with the military on high-performance signal transmission applications, we are a proven resource for ultra-miniature component development and high-volume manufacturing.
Our 40,000-square-foot facility includes:
Laboratory, office and production space · 11 class 1000 clean rooms · Three class 100 clean rooms · Seven sputtering systems · Three ion-beam milling systems · Three SUSS mask aligners · Separate production and development areas and equipment
Our Clean Room Assembly includes
Substrate cleaners · Photo-resist coaters · Exhaust hoods · Microscopes · Gages · Equipment for visual and microscopic inspection
With 11 available Class 1000 clean rooms, we manufacture a broad range of complex precision components and products and provide wafer/substrate processing. Our technicians are accustomed to working with very small, delicate substrates and components during clean room manufacturing processes.
