Encapsulation

Materials for semiconductor manufacturing process: polymer (Resin), photoresist (PAG), and additives, and materials such as Resin for SOC, Resin for BARC, and Acid Generators. Coating materials

Semiconductor products: photoresists (PR), bottom anti-reflective coatings (BARC), spin-on-carbon (SOC), CMP slurries, wet chemicals, colored resist, organic insulating layer materials.

photoresist resin for IC, SQ board,

Special polymer materials for electronics

Epoxy molding compounds, casting compounds, flexible copper clad laminates, photoresists, adhesive wafer mounting tape

Molding compounds for electronic packages. EMC, coatings for opto and semiconductor products.

Potting material, Jelly Gel, Sealant & Adhesive, Thermal Conductity, Conformal Coating, ALubrication Grease

Epoxy molding compounds, strippers and other chemicals for the semiconductor industry.

Electrically conductive adhesives, Thermally conductive adhesives, Thermal greases, Thermal Gap-fillers, Underfill, Glob top, Dam & Fill encapsulants, UV-curable adhesives, Potting resins.

Electronic insulating films, electronic one component epoxy adhesives. Functional chemicals

Films and Electronic Materials: Polyester Film, Nylon Film, Coated Film, Prism Film, Dry Film Resist, Overcoat

Resins, adhesives and inks for the electronics industry

Advanced siloxane-based formulations and resin systems for Optical Devices, Opto Packaging and Printed Electronics.

Wafer-level liquid alloy micro-casting technology for semiconductor advanced packaging, MEMS devices and three-dimensional integrated passive devices.

Electronic grade novolac phenolic resin, specialty epoxy resin, maleimide resin,and photoresist-grade novolac phenolic resin. Advanced PCB resin materials, TFT photoresist，photosensitive polyimide （PSPI） type dielectrics，epoxy resin

Semiconductor silicone and epoxy product sealants

Electrically conductive sheet and compounds, antistatic tape, sheet and bags, aluminum moisture barrier bags

Photoresists and ancillaries production. Functional printed electronics materials.

Epoxy molding compounds, die attach adhesives, DBC and AMB ceramic substrates, metallized ceramics.

Die attach materials, encapsulation materials, underfills and gels, thermal greases.