Inkron, a Nagase Group Company develops and manufactures advanced siloxane-based formulations and resin systems for Optical Devices, Opto Packaging and Printed Electronics. Inkron’s core technology is centered around in-house designed and synthesized siloxane resin production combined with advanced formulation skills. Inkron has its primary manufacturing and R&D location in Finland. The optoelectronics and opto-packaging departments are in Taiwan.
Product overview
Opto-packaging products comprise adhesives, encapsulation materials and complementing optical coatings. Inkron can also support in the actual packaging process. Inkron has a complete line of tools to manufacture LEDs and other similar components.

For more details please contact us.

ADHESIVES
ENCAPSULATION
OPTICAL COATINGS

ADHESIVES
Adhesives and thermally conductive adhesives feature excellent thermal stability and adhesion, very low bleeding, and good reliability. Three main classes are distinguished:

silver-filled adhesives
white, highly reflective
transparent adhesives
complementing structural adhesives and underfills
ADHESIVES
APPLICATION
ENCAPSULATION
Inkron has a focused selection of special encapsulation materials for LEDs and other applications

ILE-501 Market leading high refractive index (RI 1.65) with very good barrier properties. Targeted on applications using red and IR light.
UV-curable encapsulant with robust fast curing.
Complementing ultra-thin barrier coating for harsh environments
ENCAPSULATION
APPLICATION

OPTICAL COATINGS
Optical coatings have a crucial role in the packaging of the optical components,  optimizing the properties of the device at hand.  Inkron develops and manufactures optically clear low and high refractive index (RI) coatings.

Low refractive index (RI), optically clear, gap filling coatings. RI range from 1.1 to 1.4.
High refractive index coatings. RI range from 1.55 to 1.9x.
OPTICAL COATINGS​
APPLICATION

Product overview
The inherent properties of siloxane, Inkron’s main resin system are perfect for optics and optics-related applications and devices. The optical clarity of the resin systems combined with good durability and thermal stability makes siloxane the material of choice for a multitude of applications. Combined with Inkron’s capability to modify the polymers according to the application requirements this creates an excellent starting point for various optical designs. The final products are formulated in-house  to meet the application-specific demands.

 

OPTICAL COATINGS
OPTICAL DIELECTRICS
OPTICALLY CLEAR ADHESIVES
OPTICAL COATINGS
Inkron’s optical coatings are Nano Imprint Lithography processable and used for application in diffractive optics. Applications cover AR/MR waveguides, 3D sensors, other NIL-based applications as well as general optics applications.

NIL processable resins, RI range 1.55-1.9x
 

These high refractive index materials are complemented by low refractive index coatings. Typical applications are seen in antireflection coatings, cladding layers, gap filling.

Low RI gap filling coatings, RI range 1.1-1.4

OPTICAL COATINGS​
APPLICATIONS
OPTICAL DIELECTRICS
The portfolio of optical dielectrics contains both inks and coating solutions. Screen printable solvent-free dielectrics guarantee pinhole-free insulation while maintaining transparency. The k-value of the basic systems is approximately 3, with the option to tune the formulation for higher and lower k-value products.  

Screen printable transparent dielectrics
Inkjetable transparent dielectrics
Dielectric coatings
High and low k value versions possible application
 

PRINTABLE DIELECTRICS
APPLICATIONS
OPTICAL COATINGS​
OPTICALLY CLEAR ADHESIVES
Inkron’s optically clear adhesives are equally thermally conductive. The refractive index can be tuned over a wide range.

Transparent, thermally conductive adhesives for demanding applications
Structural adhesives and underfills
Dual cure low RI adhesive

ADHESIVES
APPLICATIONS


Product overview
The materials for printed electronics applications form a complete package of conductors, dielectrics and adhesives. These products are fully compatible with each other.  There are inks for both screen printing and inkjetting. The products include highly stretchable versions and optically clear inks with the possibility to tune the refractive index. The conductors and dielectrics are complemented by structural adhesives and underfills often needed in In-Mold-Electronics. Inkron controls the whole process starting from the synthesis of the polymers to the final formulation, and so can quickly modify material properties to satisfy customer specifications.

CONDUCTIVE MATERIALS
DIELECTRICS
ADHESIVES

CONDUCTIVE MATERIALS
Screen printable silver inks are available in several versions for different applications and curing types.

IPC-100 series inks are solvent-free, flexible and thermally extremely stable. UV-curing is offered as an option.
IPC-600 highly stretchable screen printing inks
 

These inks are supported by the matching dielectrics and adhesives.

APPLICATIONS
PRINTABLE CONDUCTORS
DIELECTRICS
The dielectric inks portfolio addresses both screen and inkjet-printing. Printable dielectrics feature UV- and thermal cure versions.
These solvent-free dielectrics are pinhole-free and thus provide very good insulation properties.

IPD-300 inks are flexible, highly durable inks
IPD-600 inks are stretchable and thermo-formable
IPD-350 and 372 are inkjetable. Thermal and UV cure.
Optically clear high RI dielectric inks are available. Please get in touch with Inkron.

APPLICATIONS
PRINTABLE DIELECTRICS​


ADHESIVES
Adhesives include thermally conductive materials with excellent thermal stability and adhesion, very low bleeding, high brightness (LEDs) and good reliability. For printed electronics applications structural adhesives and underfills are essential. Inkron’s adhesives are fully compatible with the inks offered.

Thermally conductive adhesives (silver-filled, white and transparent)
Structural adhesives and underfills (silver-filled and dielectric) for applications requiring thermoforming and other demanding process steps
APPLICATIONS
ADHESIVES

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