Die Attach Adhesives

Packaging and bonding materials in the semiconductor and electronics field.

Special polymer materials for electronics

Wire saw cutting auxiliary materials- adhesives, coolants, beams.

Electrically conductive adhesives, Thermally conductive adhesives, Thermal greases, Thermal Gap-fillers, Underfill, Glob top, Dam & Fill encapsulants, UV-curable adhesives, Potting resins.

Conductive Die Attach, Non Conductive Polymer, Flux, Solder Balls

Electronic insulating films, electronic one component epoxy adhesives. Functional chemicals

Electronic Adhesives, Inks, Pastes and Coatings

Underfill Materials, Die Attach Adhesives, Wafer Level Materials, Optoelectronic Materials, Conformal Coatings.

Resins, adhesives and inks for the electronics industry

Advanced siloxane-based formulations and resin systems for Optical Devices, Opto Packaging and Printed Electronics.

Adhesives, potting and encapsulation products for semiconductors and electronics.

Semiconductor silicone and epoxy product sealants

Die attach adhesives and films (DAF), EMI absorber

Die attach adhesives for solar, LED, semiconductor.

Adhesives, solvents for semiconductors

Die attach adhesives, photoresists, conductive inks, encapsulants.

Epoxy molding compounds, die attach adhesives, DBC and AMB ceramic substrates, metallized ceramics.

Die attach materials, encapsulation materials, underfills and gels, thermal greases.

Die attach materials and conductive inks and pastes

Die attach materials, underfill materials. Conductive, EMI shielding pastes. Thermally and electrically conductive and insulating films.