Chipcoat
Chip-on-Film Underfill (COF)
Flip Chip Underfill (UF)
Dam-and-Fill Encapsulant
CSP/BGA Board Level Underfill (SUF)
Camera module adhesive
Die Attach Adhesive (Non-Conductive)
Low-temperature Curable Adhesives
Unimec
Electromagnetic Interference (EMI) Shielding Paste
Air-curable Conductive Copper Paste
Stretchable Pastes
Surface Mounting Adhesives
Pastes for Terminal Electrodes of Passive Components (Unimec)
Flip Chip Adhesive (SBB)
Die Attach Adhesives (Unimec)
Pastes for Electrodes on the Back/Front of Solar Cells (Unimec)
Low-temperature sintered high thermally conductive die attach pastes using MO technology
Himec
Pastes for Terminal Electrodes of Passive Components (Himec)
Pastes for Internal Electrodes of Passive Components
Overcoat
Chip resistor protective coating
ADFLEMA
Insulating adhesive film for high frequency, high speed transmission flexible (FPC) and rigid electronic circuit substrates
High functionality insulating adhesive film for electronic parts and modules
Non conductive film with high thermal conductivity
Adhesive Film (For machines and measuring devices)
Solvent removable film for MEMS
Sealing glass
Low-temperature sealing glass
Metal Organic (MO) Technology
Low-temperature Sintered Conductive Pastes Using MO Technology
New Products
Pre-applied non-conductive underfill (PAM)
Dielectric Coating
Electromagnetic Interference (EMI) Shielding Paste
Air-curable Conductive Copper Paste
Stretchable Pastes
