Films

PEEK Materials for Semiconductor Industry. Including PEEK Film, PEEK Sheet, PEEK Rod, PEEK Tubing, PEEK Part & Components.

Semiconductor: FOUP Cleaner, POD Cleaner, Wet Station, Chemical Delivery Supply System, Metal Lift Off, Cassette & Magazine Cleaner. Display: OLED Mask Cleaner, Glass Cleaner, Etcher & Stripper, Auto Macro Inspection, Stream-Jet Printing, Lamination M/C,

Polypropylene (PP), high-purity terephthalic acid (TPA), polyketone (POK), as well as nylon, polyester, TAC films used for wrapping or industrial & optical use, and special gases like NF3, 20%F2/N2 used in semiconductors, displays

Wafer manufacturing equipment. LCD mnfr equipment, Wafer mounter and BG tape removal machines, dry lift-off machines, wafer and pkg substrate tape lamination and removal machines, UV irradiation equipment, film resist lamination machines.

Molding compounds for electronic packages. EMC, coatings for opto and semiconductor products.

Volatile Corrosion Inhibiting Film, Water Soluble Film, Containers for Ultrapure Chemicals, Ultra-clean Packaging for Mission Critical Application, Sealant Film for Lamination

Release film for semiconductor and LED package. Solar-cell module backsheets

Films and Electronic Materials: Polyester Film, Nylon Film, Coated Film, Prism Film, Dry Film Resist, Overcoat

CMP Pad, CMP slurry, mask blanks. Optical films for FPD.

Double-side Adhesive Tape, Protective films, Functional Tapes, opticals films for OLED and LCD. Clean-room engineering design, construction, maintenance integrated solution and ultra clean products.

Industrial Materials, Precision Devices and Components, Display Components, Functional Films, QFN lead frames.

Electronics films and polymers

Photomasks, BGA IC packaging service, on-chip color filters, IC design, films for solar, e-ink and barrier.

Polymer film based copper clad lamiate, cover layer, PV module backsheet, FCCL (Flexible Copper-Cladded Laminate), Optical film material

Semiconductor Advanced Packaging Material R&D and Manufacturing. Wafer prtection films, wafer warpage control films, build-up films, laser molding films and wafer de-bonding films.

Dicing tapes, wafer mounters, die ejector, pick and place system, die matrix expander, die bonders, FOUP and cassette cleaners

Tapes and films for semiconductor industry

Die attach materials, underfill materials. Conductive, EMI shielding pastes. Thermally and electrically conductive and insulating films.

Backgrinding and dicing tapes, DAF die attach films, polarizing films, encapsulation compounds, OLED materials.

Dicing, backgrinding and DAF die attach fil,s. Encapsulation materials for packaging. Coatings. Dia attach materials.