DAM & FILL AND GLOB-TOP
To coat and protect components.
The Dam provides a protective barrier around the component, while the Fill fills in the area created by the Dam.
Glob-top provides the same two functions for smaller components.
DIE-ATTACH
Die-Attach is the bonding of semiconductors to substrates with an adhesive that is either electrically conductive or insulating.
THERMAL DISSIPATION
Thermally conductive adhesives and resins that dissipate component operational heat generation.
ENCAPSULATION AND POTTING
Liquid insulating resins used to encapsulate printed circuits and electronic components, protecting them from environmental stressors.
UNDERFILL
Underfill is placed between a chip, or a BGA, and its support. The adhesive protects against possible shocks, drops and vibrations.
