Suzhou runde new material co., LTD. Founded in 2013, Focuses on providing complete sets of high-quality solutions for cutting ultra-hard and brittle products.The products developed by our company, such as cutting support plate, cutting adhesive and cutting fluid, are widely used in the auxiliary cutting of ultra-hard and brittle materials such as silicon and sapphire in the industries of photovoltaic, semiconductor and magnetic materials. Since RUNDE establishment, our company has been adhering to the tenet of "market as the guidance, quality as the foundation", and has established excellent reputation in the industry with our great quality and public praise, and has successively become the stable partner of more than 100 well-known photovoltaic and semiconductor enterprises at home and abroad.

In the face of fierce market competition, our company has constantly increased its investment in research and development, and also management. In the past five years, our company has obtained dozens of patents, and passed the ISO9001 quality management system certification in 2015.At the same time, our company actively cooperates with ZheJiang university, Harbin institute of new materials and other institutions to overcome one technical difficulty after another. In the future, RUNDE will be full of confidence with you, provide all the support you need for your multi-line cutting business.

One component adhesive(for silicon ingot) RD902
One component adhesive(for steel plate) RD905
Two-component adhesive(for silicon ingot) RD702(1:1)
Two-component adhesive(for steel plate) RD621(1:1)





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