KCC manufactures packaging materials that are applied to the packaging process to mount semiconductor devices and protect them from the external environment. We manufacture adhesives for bonding semiconductor chips to substrates or lead frames, encapsulants to protect chips, and ceramic substrates applied to power semiconductor modules. Semiconductors are an essential element of all electronic devices today, and the need for high-density, high-integration, and lightweight, compact and compact package technology is expanding according to the trend of electronic products that require miniaturization together with high performance/multifunctionality. We are providing our customers with a competitive semiconductor packaging total solution.
EMC Epoxy Molding Compound Product Datasheet
Adhesive Product Datasheet
Metalized Ceramics Product Datasheet
Ceramic Substrates Product Datasheet
