Dicing and Grinding Films and Tapes

PEEK Materials for Semiconductor Industry. Including PEEK Film, PEEK Sheet, PEEK Rod, PEEK Tubing, PEEK Part & Components.

Semiconductor: FOUP Cleaner, POD Cleaner, Wet Station, Chemical Delivery Supply System, Metal Lift Off, Cassette & Magazine Cleaner. Display: OLED Mask Cleaner, Glass Cleaner, Etcher & Stripper, Auto Macro Inspection, Stream-Jet Printing, Lamination M/C,

Polypropylene (PP), high-purity terephthalic acid (TPA), polyketone (POK), as well as nylon, polyester, TAC films used for wrapping or industrial & optical use, and special gases like NF3, 20%F2/N2 used in semiconductors, displays

Polishing pads and films

Epoxy molding compounds, casting compounds, flexible copper clad laminates, photoresists, adhesive wafer mounting tape

Precision dicing saws and machining systems for Semiconductors, Photonics, MEMS, PZT & Piezo materials, special materials and related industries

Molding compounds for electronic packages. EMC, coatings for opto and semiconductor products.

Specialty and semiconductor gases, such as Monosilane, Disilane, and Silicon Tetrafluoride. Backgrinding UV and non-UV Tapes IGROS(TM)

Epoxy molding compounds, strippers and other chemicals for the semiconductor industry.

Volatile Corrosion Inhibiting Film, Water Soluble Film, Containers for Ultrapure Chemicals, Ultra-clean Packaging for Mission Critical Application, Sealant Film for Lamination

Release film for semiconductor and LED package. Solar-cell module backsheets

Films and Electronic Materials: Polyester Film, Nylon Film, Coated Film, Prism Film, Dry Film Resist, Overcoat

Clean Room Supplies: Cleaning Chemicals and Wipes, Cleaning Equipment, Garments, Static Control Supplies. Consulting: Clean Room and Contamination Control.

Wafer Cases, Polythiophene-base conductive polymer, Embossed/Blister carrier tape, Frame for wafer dicing

Double-side Adhesive Tape, Protective films, Functional Tapes, opticals films for OLED and LCD. Clean-room engineering design, construction, maintenance integrated solution and ultra clean products.

Dicing saw machine, wafer tape mounter, wafer expander, UV irradiation machine, wafer cleaning machine. Dicing and back grinding supplies: blades, chucks, UV films, spindles etc.

Electronics films and polymers

Photomasks, BGA IC packaging service, on-chip color filters, IC design, films for solar, e-ink and barrier.

Polymer film based copper clad lamiate, cover layer, PV module backsheet, FCCL (Flexible Copper-Cladded Laminate), Optical film material

Adhesive tapes for the Semiconductor Industry