Flip-chip bonding and die attach adhesive solutions for smart label applications
The heart and soul of RFID technology is a small chip that is capable of both storing information and transmitting data to a receiver via radio waves. A built-in antenna is necessary for communication with the reading device. This unit can then be placed on the item in question, for example as a smart label.
Die attach adhesives and flip-chip bonding: Safe and lasting adhesion for electric contacts
Flip-chip bonding has obvious advantages over chip-on-board (COB) technology when it comes to mounting unpackaged semiconductor chips on circuit boards: Where COB technology needs four steps, flip-chip bonding is done in two. Flip-chip contacting uses electrical connectors in the shape of 'contact bumps' on the semiconductor chip's active side. Microchips from manufacturers only need to be placed into the pre-applied adhesive – and cured. Compared to COB technology, manufacture saves two process steps: electrical contacting and chip encapsulation. DELO carries both die attach adhesive solutions and anisotropic, conductive glues. DELO is also in the lead when it comes to flip-chip processes in RFID applications!
Realize miniaturization goals with DELO glue and die attach adhesive solutions
Semiconductor packaging moves towards miniaturization and thinner chips. Demands are manifold, such as superb reliability, easy processing, short cycle times and various applications in smart cards. This calls for tailored adhesives! Especially when it comes to die attach adhesive solutions, products for COB technology and flip-chip bonding, DELO offers a broad range of innovative solutions. Find out more about DELO's portfolio for semiconductor packaging online!
Properties
Optimized products for various chip sizes
Improved flow behavior
Solder-free joins are possible
High temperature stability up to +260 °C
High ion purity, Halogen-free
Products tested according to JEDEC MSL 1
UV-curing and heat-curing solutions are possible
Excellent adhesion to many substrates
Application examples
Die-attach leadframe
Die attach
Die attach adhesives in leadframe packages require a high temperature resistance for lead-free soldering processes, good electrical and thermal properties, and the possibility of low-tension curing. DELO has adapted its products to exactly meet these requirements.
Semiconductor packaging
Encapsulants for the chip-on-board (COB) technology
Encapsulants are required by electronic components in many industries. The requirements are manifold. These include extremely high reliability, easy processing, short cycle times, and diverse tasks in the smart card industry. DELO offers a wide range of products that ideally match all of these needs.
Sealing of oil pressure sensors
Sealing of sensors
The new anhydrides have proven successful in practice. These products are used in oil pressure sensors in cars. They cast the inside of the sensor and also seal the electrodes.
Optoelectronics: DELO's optically clear adhesives for compact camera modules and more
Optoelectronics is one of the main disciplines where technological development is happening right now! The term itself refers to light and microelectronics: Hence, optoelectronics includes all components that convert electrical energy into light and vice versa. Powerful optoelectronic components have made significant progress possible: in computer technology, in telecommunication, in micro-optics, in sensor and manufacturing technology alike. A cell phone's compact camera module is just one example.
When it comes to glue, most people think: cloudy, tough and sticky – quite to the contrary of contemporary applications with clear, optically transparent solutions! This new generation of adhesives fixes, seals and holds up to optical demands and takes on optical jobs – beyond mere bonding: New micro-optical applications for LEDs and wafer level cameras, small cameras in cars and cell phones (such as compact camera modules) put high demands on materials and adhesives. In addition to resilience and thermic UV stability, industrial adhesives convince with low rates of gas emission and shrinkage. DELO carries a range of formulas developed specifically to meet these demands. Some of these products don't just offer lens bonding but take on the job of lenses themselves!
Cleaner energy: DELO adhesives for best wafering results in solar panel production
Renewable energy sourced from wind, water and sunlight is an important, growing market. When it comes to private housing, solar cells and photovoltaics are popular to produce energy in a sustainable way. Special solar panel bonding adhesives by DELO help optimize wafering and wafer slicing, a necessary step in solar cell manufacture.
Here, two-component epoxy resins optimize efficiency by offering high thermal stability and customized separating behavior. This enables high throughput rates. In addition, these resins are suitable for high-speed diamond wire saws.
Innovative DELO adhesives for wafering processes
When producing thin-film cells, bonding has been replacing soldering more and more – thanks to conductive adhesives by DELO. Ordinary silicon solar panel production also relies on glues: Here, bonded silicon blocks are clamped onto the wire saw's mounting plate to slice them into wafers (wafer cutting). Adhesives have to keep the freshly-cut wafering units tightly connected to the mounting base for the entire length of the process. Afterwards, the wafers have to be separated from the mounting plate without leaving any residue, for example by bathing them in hot water. This demands for adhesives to adhere to the carrier – avoiding contamination of water and silicon alike. DELO's two-component RM compounds (ReMovables) are customized to meet the complex demands of wafering and wafer slicing, hence enabling high throughput rates in production. Find more information on DELO's website!
Application examples
DELO adhesives for photovoltaics wafer cutting
Adhesives for wafer cutting
The increasing cost pressure on the photovoltaics market means that production processes must be optimized continuously. DELO’s two-component RM compounds (ReMovables) are precisely tailored to the high requirements in the wafering process, and therefore make possible high output rates. To prepare the cutting process, the assembly plate, the loss plate or carrier, and the silicon ingots are bonded and fixed.
Solar cell bonding
Contacting of thin-film cells
Contacting of thin-film cells by conductive adhesives is a gentle conducting method and has numerous advantages over conventional methods like soldering and ultrasonic welding. The maximum curing temperature of the adhesives is +150 °C, which is significantly lower than the temperature during soldering.
