Flip Chip Solutions for Advanced Semiconductor Packaging
The need to improve device performance, while complying with package miniaturization demands, is driving flip chip development. Henkel provides a variety of high performance, JEDEC- compliant, lead-free underfill technologies for today’s most challenging flip chip designs.
Henkel’s underfill systems have been specifically designed to meet the demands – primarily lowering stress, controlling warpage and increasing reliability – of thinner, modern semiconductor flip chip devices.
Henkel offers a broad product portfolio of die attach, as well as liquid and film encapsulants for flip chip devices including for CSP, BGA and PoP. These include capillary underfill
(CFU), non conductive paste (NCP), non conductive film (NCF) and warpage improvement adhesives (WIA).
3d illustration of silicon wafer used as substrate for building integrated circuit devices represents henkel's wafer level liquid compression molding and encapsulant materials enabling outstanding protection for these delicate devices
Wafer Level Solutions for Advanced Semiconductor Packaging
When it comes to wafer-level underfill and encapsulant technology, Henkel’s LOCTITE ABLESTIK AND ECCOBOND brand materials are world-class. Package-level underfill systems are facilitating advances in flip-chip technology, enabling outstanding protection for these delicate devices. All our package-level underfills meet JEDEC testing requirements and the demands of lead-free processing. Further protection is provided with Henkel's semiconductor encapsulants, which work together as dam-and-fill materials for bare chip encapsulation. Our high-purity liquid epoxy encapsulants offer protection from mechanical damage and corrosion during the assembly process.
3d illustration of a RAM random access memory device
Memory Pack Solutions for Advanced Semiconductor Packaging
The Henkel Bond in Memory Pack Manufacturing
The quality of a memory module is directly related to its DRAM (Dynamic Random Access Memory) chips. Henkel recognizes the importance of this essential memory system in computers and workstations, and provides an array of products than improve the consistency and reliability of the DRAM assembly process including printable paste die attach adhesives that offer reliable bonding with low moisture uptake and bleed, some of which require no curing.
As semiconductor technology changes so does the demand for more and different types of memory products. As these changing expectations drive developers to create more robust applications, Henkel’s adhesive products are prepared to meet the challenges of tomorrow’s semiconductor industry.
Flash Memory Solutions
Flash memory forms the data storage of mobile phones, core of MP3 players and most semiconductor memory card formats available today. Demand for these non-volatile memory devices has grown rapidly due to the expansion of mobile handsets, MP3 players and memory cards.
Henkel offers die attach paste and film adhesives that play a critical role in flash memory assembly. The consistent application and reliable protection they provide can extend the product life of an array of consumer and industrial electronic, communications and computing products and systems, including:
Mobile phones
Digital video cameras
Personal digital assistants (PDA)
Portable digital music players (MP3)
Digital video recorders
Solid state drive
Flash memory card
