HENGHUI Technology Corporation

 , CN Manufacturer
Integrated circuit enterprise, which sets lead frame, module packaging, wafer thinning, dicing and testing as one

Loadpoint Ltd

 , GB Manufacturer,  Distributor
Precision dicing saws and machining systems for Semiconductors, Photonics, MEMS, PZT & Piezo materials, special materials and related industries


 , JP Manufacturer
Wafer slicing, dicing, grinding and polishing equipment and blades. Probing machines. CMP Equipment. Precision measuring equipment.

Chipbond Technology Corporation

 , TW Manufacturer,  Service Company
OSAT (outsourced semiconductor assembly and test) company.

The Fraunhofer Screening Fab

 , DE Manufacturer,  Custom Manufacturer,  Service Company
300mm semiconductor grade screening and evaluation services for materials, processes, chemicals and consumables from laboratory scale to production scale (for ULSI) for IC manufacturers and suppliers.

Pure Wafer

 , US Manufacturer,  Distributor,  Service Company
Supplier of virgin silicon wafers, wafer reclaim services and specialty thin film deposition products.

FlipChip International LLC

 , US Manufacturer,  Service Company
Wafer bumping, test, design and die handling services

Silicon Specialists, LLC

 , US Manufacturer,  Custom Manufacturer
Silicon wafer processing services including polishing, lapping, thinning, reclaiming, laser marking, etching and cleaning. Prime, virgin, test, coin rolled, mechanical and solar grade silicon wafers are offered. Serves the semiconductor industry.

my-Chip Production GmbH

 Rudolstadt, DE Manufacturer,  Custom Manufacturer,  Service Company,  Finishing Service Company
Specializing in slicing, grinding, dicing and characterization of brittle materials like sapphire, silicon, GaAs, ceramics and all kinds of single crystals.