Chipbond was established in 1997 July 2nd and was booked on the Taiwan Stock Exchange starting from 2002 January 31st. Chipbond Technology Corporation is the only company in Taiwan to supply a true full Turnkey Service for backend assembly processing of LCD driver ICs from wafer bumping to packaging. There are two fabs in operation, the LiHsin Plant and the Prosperity Plant are both located within the Hsinchu Science Park. Wafer bumping is conducted in LiHsin Plant whilst the subsequent backend processing such as testing, dicing and packaging is conducted in the Prosperity Plant.
The manufacturing process for driver ICs are different from the standard ICs; they are required to be manufactured by front end foundries' special process, then go through backend production by gold bumping, TCP or COF assembly process. Finally, they are sent to panel houses for final production. In recent years, Taiwan has invested more than 100 billion NTD into the photonics industry in development of TFT-LCD panels and related components. The industry has grown on a phenomenal scale and became the world leader overtaking South Korea; it is expected for the next 10
years, Taiwan will still be the dominant global supplier. As gold bumping providers are losing its profitability and survivability, Driver IC assembly industries are bound for consolidation. Thus Chipbond with its turnkey service will maintain the leading position in Driver IC assembly market, sustaining steady growth.
As our customers requested, the turnkey services of LCD driver IC package and testing will provide the service from gold/solder bumping, testing, dicing, assembly and final testing and ship the final product COF/COG to the destination as customer specified.
Integrating through Chipbond engineering process with a consistent quality control plan, our turnkey service can effectively shorten the product’s process cycle time and also provide our customer the complete technical support with the effective solution including engineering prototypes to mass production.
There are two ways of bonding Driver ICs and panels: COG (Chip on Glass) which is the direct adhesion of chip onto the LCD panel. COF (Chip on Film) / TCP (Tape Carrier Package) which is the adhesion of chip onto a tape via ILB, which is then bonded onto the LCD panel. The Turnkey service of integrating all process package technologies provides the complete COG, COF/TCP assembly process.
3.1 LCD Driver IC: (LCD Panel, PDP Panel, or OLED Panel…)
3.2 CIS: CMOS image sensor
3.3 Finger Print sensor
3.4 RFID
3.5 Medical devices
4.1 COG Turnkey service
4.2 COF Turnkey service
5.1 Wafer Bumping-mask providing, Bumped wafer
5.2 Wafer Testing- Probe card providing and maintenance, CP testing
5.3 Wafer Grinding, Dicing
5.4 Assembling-TCP/COF tape providing and ILB.
5.5 FT testing – Probe card providing and maintenance, FT test
5.6 Packing
