Wafer Downsizing, Edge Grinding

OSAT (outsourced semiconductor assembly and test) company.

300mm semiconductor grade screening and evaluation services for materials, processes, chemicals and consumables from laboratory scale to production scale (for ULSI) for IC manufacturers and suppliers.

Wafer Services: Wafer Processing, Process Development, Wafer Reclaim and Supply

Wafer bumping, test, design and die handling services

Custom manufacturer of wafers. Available up to 330 mm dia. with 0.20 mm thickness. Capabilities include planetary lapping, CNC shaping, dicing, slicing, machining, coating and polishing.

Silicon wafer processing services including polishing, lapping, thinning, reclaiming, laser marking, etching and cleaning. Prime, virgin, test, coin rolled, mechanical and solar grade silicon wafers are offered. Serves the semiconductor industry.

Specializing in slicing, grinding, dicing and characterization of brittle materials like sapphire, silicon, GaAs, ceramics and all kinds of single crystals.