FlipChip’s Phoenix, AZ based facility is a state of the art 16,000- ft2 (4700 m2), class 1000 clean room. In addition to offering the industry’s broadest assortment of wafer bumping options, FlipChip has maintained an aggressive program to develop and generate intellectual property for future implementation at FlipChip-Phoenix and in our Asian factory locations. Commitment to leadership and quality in wafer bumping solutions continues, ensuring that FlipChip remains the leader in developing, and bringing to market the latest in bumping technology. The primary bumping facility and technology development site for FlipChip is located in the World Headquarters building in Phoenix, Arizona, USA.
FlipChip International, LLC (FCI) is the world’s premier technology and merchant supplier of advanced Wafer Level Packaging solutions. FCI offers a wide range of leading edge technologies and services for flip chip wafer bumping based on our proprietary Standard Flip Chip and Wafer Level Chip Scale Packaging processes. With the industry’s broadest range of thin film redistribution, underbump metallurgy and solder alloy options, FCI can provide optimized bumping solutions targeting our customer’s specific reliability and electrical performance requirements. More than 1 million wafers per year are processed with FCI’s family of technologies.
FCI serves over 100 customers through its High Volume Manufacturing facility, R&D Laboratory, Application Development and Design Group, and Die Sales Division located in Phoenix, Arizona. Joint venture partnerships in Asia including FlipChip Millennium Shanghai (FCMS), Unisem-Advanpak Technologies (UAT) in Ipoh, Malaysia; all of which provide our customers with high-quality, high volume manufacturing second sources across our expansive product portfolio and wafer sizes.
In addition to our sputtered film Standard Flip Chip and Wafer Level Chip Scale Packaging product offerings, FCI offers a full suite of electroplated Cu based options including standard and NANOPillar Cu pillar bumps, electroplated Cu RDL for inductor on chip and high current applications.
With industry leading process and product development expertise coupled with quick time to market and production ramp up capabilities on two continents, FCI continues to provide our customers with flexible, high reliability and high quality Wafer Level Packaging solutions. FCI … Miniaturization through Innovation
FCI offers Wafer Probe Test services for 200mm (8 inch) and 150mm (6 inch) wafers. FCI partners with its customers designing and implementing the test program, probe card and test system, providing a full turnkey solution. This provides our customers with the highest quality product that is bumped, tested, diced and placed into tape and reel for the next level of assembly.
Magnum PV Tester
Configuration
Wafer sort applications from engineering to high volume production
512 I/O pins 128/256 Power
Single chassis manipulator mount
Memory
NOR Flash / NAND Flash / SRAM / DRAM / EEPROM
Single, Scalable Platform
Scales from low-channel count engineering solutions to high-channel count production solutions with superior throughput and high parallel test efficiency
One platform tests a variety of memory and logic devices, including Memory, Embedded Memory and Logic Test
Multisite Architecture
Highly parallel tester architecture automates the task of testing up to 640 devices in parallel
All I/O channels
Maximizes utilization of tester resources and maximizes parallelism
Provides maximum flexibility in mapping memory and logic devices into the available pin resources
ECR Memory per DUT
Each DUT's failure information is captured into unique memory space and is not shared with other DUTs
Each of 64 I/O pins failure are addressed abd mapped into unique memory space for highly parallel error capture performance
Prober: TSK UF200FL UF200A/AL
Feature
Thinned wafer handling capability
Perform transfer and testing on 6 to 8 inch wafer
Option
Hinge-type manipulator for test-head
SEMS transfer by special mechanism
Testing environment for minute electric current
High-voltage testing environment
Wide variety of network environment
Needle track inspecting function
Focus Tester FTI-1000
The FTI 1000 tester consists of independent test channels that allow all DC and AC MOSFET parameters to be tested either separately, or in one handler insertion or prober touch-down.
The MOSFET AC parameters tested by the FTI 1000 include Inductive Load (UIL/UIS), Gate Charge (Qg, Qgs, Qgd), Gate Resistance (Rg), Gate Capacitance (Cg, Ciss) and high voltage Switching/Timing Tests. FTI 1000 also offers analog test resources to enable Smart Power devices to be tested.
FTI 1000: Power Management IC Test
FTI 1000 performs IC and Multi-Chip Module testing using the IC Channel Board equipped with:
Multiple Quad VI’s
TMU
Pulse Generators
Comparators
Digital Instruments
C Bits with Readback
Additional channel boards can be easily added, depending on the required configuration, and each channel board can be synchronized by a cabled ‘Sync Bus’
September 1st 2014, FCI relocated its Tempe Arizona Die Sales operation to its Phoenix Headquarters. All regulatory and QMS (ISO/TS 16949) protocols will remain in place as our customers have come to expect from FCI. Flipchip International remains committed to meeting our customers’ current and future business needs.
WAFER BACK-END SERVICES
Complimenting FlipChip International’s world class Wafer Bumping & WLCSP capabilities, our WAFER BACK-END SERVICES are provided under the rigorous quality standards of ISO9001 / TS16949. FCI is also ISO 14001 certified. Supporting AUTOMOTIVE, COMMERCIAL, CONSUMER, INDUSTRIAL, MEDICAL, and MIL/AERO markets, FCI is expert with bumped & non-bumped wafers: ASIC and ASSP, Microcontrollers, Linear and Logic, Precision and Standard Analog, Memory, Power Discrete, optical and image sensors, Low K wafers, and MEMS devices, among others. Capacity exceeds 5 MILLION DIE per WEEK! Contact us for information on how we can help you with all your wafer, back-end and IC needs.
`WAFER THINNING: Mechanical Back-grinding of finished wafers (DAF)
Meeting Total Thickness Variation (TTV) demands of various final target thicknesses
Grit options available for different surface roughness requirements: Polygrind available
Non-bumped & Bumped Wafers
/`BACKSIDE LAMINATE: Backside protective coating tapes and die attach films (DAF)
Void-free application of various thickness materials to wafer backside
`WAFER LASER MARKING: Backside marking of wafer and individual die
Precise accuracy of identification marks with a variety of fonts and sizes
Marking of Logos, and special symbols
Excellent control of laser depth to maximize mark legibility and character recognition
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`WAFER DICING: Mechanical Sawing of finished wafers, substrates, and embedded die packages.
DISCO saws for 100mm, 150mm, 200mm & 300mm wafers; and laminate/flex panels.
Silicon, SiGe, Ceramic, BSG, Glass, GaAs, InP, SiC, Silicon-on-sapphire, Germanium.
Multi Project Wafers (MPW) or Zebra Masks are our specialty!
Narrow streets? No problem!
Exceptional process capabilities minimize yield loss from scratches, cracks, and chip-outs.
Standard low tack and UV releasable mounting tapes.
Large Library of saw blades to accommodate various thickness-to-exposure ratios.
Wafer cleanliness: Maintained with surfactant injected into the DI water system
/`Electro Static Discharge (ESD) controls are rigidly maintained, audible and visual alarms.
Bubblers inject CO2 into the DI water system.
Anti-static ionized work stations utilized.
Humidity-controlled work environment monitored and alarmed.
Operator grounding required, ESD precautions and procedures trained & followed.
`WAFER / DIE INSPECTION: High Volume 100% Automatic Optical Inspection (AOI).
August NSX80 / NSX95PD optical inspection tools with electronic wafer map input and output.
In-pocket TTVision AOI: Industry-leading inspection of devices loaded in carrier tape.
World class defect sensitivity for Commercial, MIL-STD-883, & customer-specific criteria.
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WAFER / DIE TRANSFER & PACK: Pick & Place (P&P) automated transfer equipment.
Muhlbauer and Laurier/Datacon High Speed Pick tools, with Die Inversion capability.
Precision pack of fragile die/sawn wafers. Die sort using wafer maps and/or ink dot recognition.
Bare Die Placement into Carrier Tape & Reel, or Bare Die Waffle Trays / Waffle Packs:
Extensive inventory of various open-tooled Carrier Tape pocket sizes.
Extensive inventory of various open-tooled Bare Die Tray / Waffle Pack pocket sizes.
Black Conductive, Static Dissipative, Anti-Static material composition.
Pack options: Ship sawn / diced wafer on foil, wafer on ring frame & tape, film frame, or on expansion grip ring.
Optional wafer re-construction for 100% KGD available on foil, ring frame, or expansion ring.
FlipChip International, LLC (FCI) offers world class Product Engineering services to our customers. FCI prides itself in being able to address customer design, processing, and reliability questions and requirements in the timeliest manner possible. To assist in this, FCI’s in-house design center is not only skilled and experienced in the finer aspects of bump tooling design but also in PWB design as well. By having this experienced design service in-house, FCI is often able to offer design turn times faster than our competitors. This allows you, the customer, quicker time to market for engineering builds and production ramps.
FlipChip International, LLC (FCI) offers world class Product Engineering services to our customers. FCI prides itself in being able to address customer design, processing, and reliability questions and requirements in the timeliest manner possible. To assist in this, FCI’s in-house design center is not only skilled and experienced in the finer aspects of bump tooling design but also in PWB design as well. By having this experienced design service in-house, FCI is often able to offer design turn times faster than our competitors. This allows you, the customer, quicker time to market for engineering builds and production ramps.
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FCI is able to work with most customer provided design files, with GDSII being the preferred design format. FCI’s Product Engineers will support you step-by-step through the design process. This includes providing you with a full design review package before a tooling or board design order is placed to ensure that all aspects of your design request are addressed.
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With our vast product engineering and design expertise, FCI can help you reach your wafer level bumping needs now and in the future. FCI… Miniaturization through Innovation.
