my-Chip Production GmbH

My-Chip Production GmbH is specialized in low-cost

- thinning,
- grinding/dry-etching and
- dicing - mechanically or by dry-etching -

of silicon wafers.

Thinning we achieve by an almost stress-free technology down to 70 - 100 microns and on special demand even less (20 microns).

Also by means of a highly effecient technology we are about to reduce dicing time down to ca. 5 min.

T H I N N I N G   A N D   D I C I N G 

My-Chip Production is specialized in constructing and producing machines which allow You to

- thin and
- dice

silicon wafers by low-cost means.

Thinning we achieve by an almost stress-free technology down to 70 - 100 µm and on special demand even less.

Also by means of a highly effecient technology we are about to reduce dicing time down to ca. 5 min. This process also simply eliminates the "edge problem" (wafer edge) dicing the wafer into chips - as we know so far.

Single machines may be adjusted to Your working conditions or we may construct and provid complete working lines for You.

Worldwide distribution and service.