Wafer Processing
We have been providing wafer processing services offering a local, high quality, reliable, value for money service to our customers for over thirty years, as well as unrivalled technical support.
We are dynamic and flexible to our customer’s requirements and take the time to really understand your needs to provide exactly what is specified.
Please see below for our wafer processing services:
Wafer Grinding and Thinning
Wafer Edge Trimming
Wafer Dicing, Dice Before Grind, Resizing
Taiko Grinding
Wafer Polishing / CMP
Multi Project Wafer Dicing & Thinning
SOI Wafer Processing
Using a combination of grinding, CMP and edge trimming, Optim is able to offer to modify SOI wafers.
SOI Processing Examples
We worked with a customer who bonded his own 150mm wafers with a specific active layer. Optim then thinned, polished and edge trimmed the device wafer to the customers specifications.
Other customers require the removal of the handle wafer post bonding and stopping on the Box layer. We have done this on 100mm and 200mm SOI bonded to Glass & Silicon handle wafers.
We have resized a 200mm SOI to 100mm or 150mm, including edge trimming and rounding.
Whichever SOI wafer processing service is used, Optim is able to clean the wafers to Semi Standard levels to allow further fabrication steps in a wafer fab.
