Micro ball Mounter
The demands of the times have made surface package evolved in various forms.
BGA / CSP is the most popular package among them, and is widely used in smartphones, tablets,
wearable terminals, and even automobile parts.
From the birth of BGA to the present, Athlete FA has always adopted the latest technology
and boasts an overwhelming track record, especially for mounting small diameter balls of CSP.

BM-1310
BM-2000WR
BM-1400W
bm-2000wi
BM-2150SI
BA-1700
BA-1420

Flip Chip Bonder
Final form of package... Flip Chip package
In 1991, Athlete FA was the first company in the industry to sell Flip-Chip bonder to the outside
and has always been a top runner in Flip Chip package.

cb-700
CB-200
cb-610
CBZ-1000
CB-1800
CB-1810
CB-505


 TAB/LCD system 

Files

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