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Solder Ball Deposition Equipment

Solder ball deposition equipment is used in the process of flip chip packaging, where a small ball of solder is deposited on the pad of the die. This allows for a direct electrical connection to be made between the die and the substrate, providing better thermal and electrical performance compared to wire bonding. The most common methods for depositing solder balls include stencil printing and evaporation. Stencil printing and evaporation are two different methods for depositing solder balls onto a substrate. Stencil printing involves using a stencil to transfer molten solder onto the substrate. This method is typically used for high-volume production of BGA (Ball Grid Array) packages. On the other hand, evaporation is a process that uses heat to vaporize the solder and deposit it onto the substrate. This method is typically used for low-volume production or prototyping applications. Both methods have their advantages and disadvantages, and the choice between them depends on the specific requirements of the application, such as the size and quantity of the solder balls, the precision required, and the cost and complexity of the equipment. Advantages of Stencil Printing: High precision: The solder paste can be accurately placed and controlled through stencil printing. Cost-effective: Stencil printing is a relatively low-cost method compared to other ball deposition methods. High volume production: Stencil printing can be easily automated for high volume production. Disadvantages of Stencil Printing: Time-consuming: Stencil cleaning and setup can take time and add to the overall cycle time. Limited size range: Stencil apertures can limit the size range of the solder balls that can be deposited. Limited material options: Some materials, such as no-clean solder paste, may not work well with stencil printing. Advantages of Evaporation: High-density deposition: Evaporation can deposit balls with a higher density than other methods. Controlled size: Evaporation can produce balls with very precise size control. Wide material options: Evaporation can work with a wide range of materials, including different alloys. Disadvantages of Evaporation: High cost: Evaporation equipment is generally more expensive than other methods. Lower precision: It can be difficult to precisely control ball placement during evaporation. Limited production rate: The production rate is generally lower for evaporation compared to other methods.

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Intlvac Thin Film Corporation

, US Manufacturer, Service Company

Customized systems for Thin Film PVD and Etch. Small R&D/pilot project systems, large production systems utilizing processes such as Ion Beam Etching, Sputtering, Electron Beam Evaporation and Thermal Evaporation fiber-optic coating and more.

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Athlete FA Corporation

, JP Manufacturer

Micro Ball Mounter, Flip Chip Bonder, Customized Machine, TAB/LCD System

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Sikama International, Inc.

, TW Manufacturer

Solder reflow & support equipment for wafer bumping, wafer flux coating, curing.

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Shuztung Machinery Industrial Co Ltd, WisePioneer

, TW Manufacturer

TFT LCD and OLED equipment, FPD AOI Equipment. MEMS packaging equipment

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Zen Voce Corporation

, TW Manufacturer

Dicing saw, singulation jig saw, cleaner, ball mounter tool, test tools and software.

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Tani Electronics Corporation

, JP Manufacturer

Solder ball bumping equipment, sintering systems

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Pac Tech – Packaging Technologies GmbH

, DE Manufacturer

State-of-the-art automated equipment to the Wafer Level Packaging and Backend Industries.

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