Tani Electronics Corp has 3 core business model with technology development , Semiconductor and STM process development. By Technology Development Project of the Tokyo head office is backed up from both hardware and software production sites of the Fukushima plant, it is a business style that aims to improve the competitiveness and the activation of the related business and semiconductor-related businesses SMT of the plant.
Printing for Wafer Bumping
TD-4421 for Wafer bumping
Over 4 inch wafer available. Original squeegee has been mounted and provide 100μsize low cost bumping technology.
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High though-put, High-performance with low cost owner ship
Original squeegee unit (patented)
Automated mask cleaning system can provide full-auto operation
Best fit for mass-production
Closed Squeegee Unit
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Cartridge holder type
Roil technology can provide smooth and keep best viscosity
Various of solder paste type, cartridge available
Stable refill and printing
