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Ribbon Bonder

A ribbon bonder is a type of assembly and packaging equipment used for attaching metal ribbons, such as gold or aluminum, to the interconnects of microelectronic devices or integrated circuits. The ribbon bonding process creates a secure and durable electrical connection between the device and the metal ribbon, which can then be used to connect the device to other electronic components or systems. This process typically involves using a heated bonding tool to bond the ribbon to the device, followed by a cooling step to solidify the bond. There are various types of ribbon bonders, including thermal compression bonders, thermal wedge bonders, and ultrasonic bonders, each with their own advantages and disadvantages depending on the application. Ribbon bonding and wire bonding are both techniques for connecting a die to a lead frame in a packaged semiconductor device. In ribbon bonding, a flat ribbon of aluminum is used to make multiple bond connections simultaneously, while in wire bonding, a thin wire is used to make one bond at a time. The choice between ribbon bonding and wire bonding depends on the specific requirements of the device and the manufacturing process. Wire bonding is more versatile, as it can be used for a wider range of devices, and it can also provide more precise control over the bonding process. On the other hand, ribbon bonding is faster and more efficient, as it can make multiple connections at once, which makes it ideal for high-volume production. Additionally, ribbon bonding can provide better mechanical stability, as the flat ribbon provides a more robust connection than a single wire.

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Capcon Limited Co., Ltd

, HK Manufacturer

Capcon provides innovative solutions like Flip-Chip Bonder, Chip-on-Wafer Bonder, Package-on-Package Bonder, Stack Die Bonder, Pannel-Level Die Bonder, Multi-Chip Die Bonder

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Palomar Technologies, Inc

, US Manufacturer

automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow processes.

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All Ring Tech Co Ltd.

, TW Manufacturer

Automation equipment for semiconductor, passive components and LED manufacturing process. Dispensers, Die and Wire Bonders, AOI and Measurement, Testers and Sorters.

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Shenzhen Xinkong Semiconductor Technology Co.,Ltd

, CN Manufacturer

Soft solder die bonder, wire bonder

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Hesse GmbH

, DE Manufacturer

Ultrasonic bonding and welding machines

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F&K DELVOTEC Bondtechnik GmbH

, DE Manufacturer

Wire bonders. Laser bonders for Al and Cu ribbon bonding to DBC substrates.

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Guangzhou Minder-Hightech Co.,ltd

, CN Manufacturer

Wire bonders, soldering and dispencing robots, welding machines. LCD repair equipment. Environment testing equipment.

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Infotech AG

, CH Manufacturer, Custom Manufacturer

Solutions for power module production, die bonding and fluid dispensing. Semiconductor and optoelectronic packaging platforms and cell.

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