Lapping Equipment

Surface processing equipment for the semiconductor industry. Wafer Grinding, Polishing, CMP, Bonding/Cleaning/Brishing Equipment

Lapping, polishing, thinning and CMP equipment.

Precision grinding, lapping, polishing, deburring and advanced materials processing equipment

Grinder, Cutting machine and Polishing machine for Sapphire /SiC/ neodymium /GaN/ ceramics / single crystal silicon / polycrystalline silicon / gallium arsenide / quartz glass / glass / crystal / carbon / germanium / ferrite and others

Wafer Backside Grinding Machine, Polishing Machine, Lapping Machine, Slicing Machine, Ingot Processing Machine

Advanced surface & sample preparation equipment and consumables.

Electronic Materials: Metal Powder Cores, MnZn, NiZn, Metal Powder Cores, Sapphire Crystal Materials, LT/LN. FPD, power molding and environment equipment.

CMP, grinding and substrate manufacturing equipment for use in the production of semiconductor devices.

Crystal growing furnace, semiconductor cutting, grinding, polishing and other intelligent crystal processing equipment. Polishing fliuds. Quartz crucibles.

Silicon and glass cutting, grinding and sawing machines

Thin film process equipment that enables high-tech electronic device production and development all over the world

Semiconductor machinery for wafer slicing, grinding, lapping, polishing.

Manufacturer of Sawing - Grinding - Lapping - Polishing Process and Equipments to Green Energy Industries

Manufacturer of wafer polishing systems, solutions and materials.

Manufacturer of wire saw and ingot grinding machines for semiconductor, ceramic and sapphire materials.

Manufacturer of grinding and polishing machines for semiconductor materials