Okamoto designs and builds various machines for precision abrasive processes. Those are used in Surface Grinding Machines, Cylindrical Grinding Machines, Internal Grinding Machines, Gear Grinding Machines, and Semiconductor Equipment’s
Abrasive processing is an important role as one of the backbone processing technology to support the IT, digital consumer electronics, automotive, and the semiconductor industry.
„Shine“ technology that our company has cultivated over many years supports state-of-the-art industries such as power devices for automobiles, mother glass for flat-panel, information equipment, and so on and is also involved in our living fields.
Okamoto produces semiconductor equipment for the following processes:
- Wafer Backside Grinding Machines
- Polishing and CMP Machines
- Lapping Machines
- Slicing Machines
- Ingot Processing Machines