Logitech was founded in 1965. The company was developed from a research project into advanced semiconductor materials at the University of Glasgow.
With over 50 years of experience in the design and manufacture of materials processing technology, Logitech has gone from strength to strength producing cutting edge system solutions that enable our customers to achieve high industry standard results across a wide range of materials and applications.
PRECISION LAPPING & POLISHING SYSTEMS
Precision Lapping & Polishing systems whether you need controlled flat surfaces, small volume throughput or automated processes.
CHEMICAL & CHEMICAL MECHANICAL POLISHING
Offering nanometer level material removal capabilities with systems that can be tailored to your applications needs.
DRIVEN HEAD LAPPING & POLISHING TOOLS
High speed systems that process multiple samples simultaneously with high geometric precision, with a high quantity throughput.
BONDING & IMPREGNATION
Prepare your sample for processing & analysis without comprise with our wide range of bonding & impregnation units.
TEST & MEASUREMENT
Logitech has a wide range of test & measurement tools which work seamlessly with our precision machinery to ensure you get the best results from your processes.
CUTTING & SAWING
Our wide range of cutting & sawing tools are ideal for slicing a variety of samples with high precision, low damage cutting with minimal kerf loss.
CONSUMABLES
Logitech consumables carefully chosen to work in unison with our sample processing systems for optimal performance. Order today on our online store.
VIEW ALL
View our full range of precision systems.
ACCESSORIES
Logitech accessories are designed to work hand in hand with our precision systems to enable you to achieve the highest quality results from your system.
Bringing an adaptable range of systems for defect free & edge polishing.
With over 50 years experience in the design and manufacture of high precision equipment. We are well respected in Optoelectronic material processing to precise tolerances with scratch free surfaces.
Application Analysis
Our systems are typically used in the processing of:
Silicon
Sapphire
Silicon Carbide
Gallium Nitride
Diamond
Lithium Niobate
Lithium Tantalate,
Bismuth Silicon Oxide
Barium Titanate
Other opto-electronic materials
A Logitech system for polishing optoelectronic devices would typically include:
Slicing the wafer from the crystal boule
Smooth automated lapping / lapping of both wafer faces
Polishing one or both faces to achieve defect-free surfaces
Cutting of substrates from the polished wafer
Forming an optical guide channel on the polished surface
Bonding of diffused plates to form a stack between end wasters
Polishing ends flat and square with minimal edge roll-off and chipping
