Test Programms

Radio signal monitoring product

Reliability, Reliability Test, Quality Test, Failure Analysis, Analysis, R&D, Test, Life Test

Parametric electrical tests (E-test), wafer-level and package-level reliability (WLR & PLR), mixed signal tests, assembly and packaging services, probe cards, load boards, test interfaces and sockets.

Manufacturing Execution System (MES), Statistical Process Control (SPC), Equipment Automation Program (EAP), Receipt Management System (RMS), Data Analysis System (EDA), Fault Detection & Classification(FDC) and Master Data Management (MDM).

automation solutions to improve the productivity of semiconductor package testing. Our automation platforms handle the growing diversity of IC package types and applications resulting from the current environment of mass customization.

Probe cards, wafer prober and test sockets for semicoductor test, and providing equipment (testers, probe unit and prober) for array inspection, TEG test, Open/Short test, cell panel inspection and repair equipment for FPD.

Flash memory test equipment, software and test programes.

Power discrete and analog IC ATE (Automatic Test Equipment)

Probe cards and systems. Photonics probers, testers, sorters and AOI. Temperature cycling test systems.

Semiconductor testing and burn-in services

Burn-In and test sockets and test systems.

RF and MW test & measurement instruments. RF signal generators. Frequency synthesizers. Phase Noise Analyzers.

Non-contact sheet resistance meters, 4-point probes. Vacuum ready components.

Automated Test Equipment (ATE) manufacturer.

Semiconductor test facility. Failure and reliability analysis, component characterization.

Custom Mixed Signal ASIC Design

OSAT (outsourced semiconductor assembly and test) company.

Test Technology & Engineering company specialized in solutions & services that enable semiconductor manufacturers to improve the efficiency and quality of their testing

Test equipment targeted at the semiconductor industry.

Simulation Software, Design Services, Optical Communications, Integrated Photonics, Fiber Optics and DSP